MSI PRO B760-P WIFI LGA 1700 ATX specs
Motherboards Specs >> MSI >> MSI PRO B760-P WIFI LGA 1700 ATX| Specifications | | | Reviews |
General Specs MSI PRO B760-P WIFI LGA 1700 ATX Motherboard
Chipset:
Intel B760
CPU Socket:
LGA 1700
Memory Slots:
4x 288-Pin
Memory Support:
DDR5 4800, 5000, 5200, 5400, 5600, 5800, 6000, 6200, 6400, 6600, 6800 MT/s
Storage Slots:
1x M.2 (M Key) 2242, 2260, 2280, 22110 (PCIe 4.0 x4)
1x M.2 (M Key) 2242, 2260, 2280 (PCIe 4.0 x4, SATA III)
1x M.2 (M Key) 2242, 2260, 2280 (PCIe 4.0 x4, SATA III)
Expansion Slots:
1x PCIe 4.0 x16
1x PCIe 4.0 x4
3x PCIe 3.0 x1
1x PCIe 4.0 x4
3x PCIe 3.0 x1
Wi-Fi:
Wi-Fi 6E (802.11ax); Tri-Band (2.4, 5, & 6 GHz) with MU-MIMO Support
Form Factor:
ATX
CPU MSI PRO B760-P WIFI LGA 1700 ATX Motherboard
Chipset:
Intel B760
CPU Socket:
LGA 1700
Back Panel I/O MSI PRO B760-P WIFI LGA 1700 ATX Motherboard
USB:
Universal Serial Bus
Universal Serial Bus1x USB-C (USB 3.1/3.2 Gen 2)
2x USB-A (USB 3.1/3.2 Gen 2)
4x USB-A (USB 2.0)
2x USB-A (USB 3.1/3.2 Gen 2)
4x USB-A (USB 2.0)
Thunderbolt:
No
Display:
1x HDMI 2.1 Output
1x DisplayPort 1.4 Output
1x DisplayPort 1.4 Output
Audio:
1x S/PDIF
5x 1/8" / 3.5 mm
5x 1/8" / 3.5 mm
Ethernet / Controller:
1x Realtek RTL8125BG 2.5Gigabit
PS/2:
1x PS/2
Wi-Fi Antenna:
2x Connector
Memory MSI PRO B760-P WIFI LGA 1700 ATX Motherboard
Memory Slots:
4x 288-Pin
Memory Support:
DDR5 4800, 5000, 5200, 5400, 5600, 5800, 6000, 6200, 6400, 6600, 6800 MT/s
Maximum Capacity:
192 GB
Channel Architecture:
Dual Channel
ECC Support:
Non-ECC Unbuffered
Storage Expansion MSI PRO B760-P WIFI LGA 1700 ATX Motherboard
SATA:Serial Advanced Technology Attachment
Serial Advanced Technology Attachment4x SATA III
Storage Slots:
1x M.2 (M Key) 2242, 2260, 2280, 22110 (PCIe 4.0 x4)
1x M.2 (M Key) 2242, 2260, 2280 (PCIe 4.0 x4, SATA III)
1x M.2 (M Key) 2242, 2260, 2280 (PCIe 4.0 x4, SATA III)
Optane Memory Support:
No
RAID Support:
RAID 0, 1, 5, 10 (SATA)
Internal I/O MSI PRO B760-P WIFI LGA 1700 ATX Motherboard
Expansion Slots:
1x PCIe 4.0 x16
1x PCIe 4.0 x4
3x PCIe 3.0 x1
1x PCIe 4.0 x4
3x PCIe 3.0 x1
USB:Universal Serial Bus
Universal Serial Bus1x USB 3.0 / 3.1/3.2 Gen 1 Header (Supports 1 USB-C Port)
1x USB 3.0 / 3.1/3.2 Gen 1 Header (Supports 2 USB-A Port)
2x USB 2.0 Header (Supports 4 USB-A Port)
1x USB 3.0 / 3.1/3.2 Gen 1 Header (Supports 2 USB-A Port)
2x USB 2.0 Header (Supports 4 USB-A Port)
Air Cooling:
1x 4-Pin CPU
5x 4-Pin System
5x 4-Pin System
Liquid Cooling:
1x 4-Pin Pump
Power Connectors:
1x 24-Pin Mainboard
1x 8-Pin ATX
1x 4-Pin ATX
1x 8-Pin ATX
1x 4-Pin ATX
Security:
Chassis Intrusion, TPM Module, TPM Header
LED Header:
3x RGB
Audio:
1x S/PDIF
Add-On:
1x Thunderbolt Header
Legacy:
1x Serial
1x Parallel
1x Parallel
Front Panel I/O MSI PRO B760-P WIFI LGA 1700 ATX Motherboard
Front Panel I/O:
USB 3.0 / 3.1/3.2 Gen 1
Audio MSI PRO B760-P WIFI LGA 1700 ATX Motherboard
Audio Codec:
Realtek ALC897 (7.1-Channel)
Wireless MSI PRO B760-P WIFI LGA 1700 ATX Motherboard
Wi-Fi:
Wi-Fi 6E (802.11ax); Tri-Band (2.4, 5, & 6 GHz) with MU-MIMO Support
Bluetooth:
5.3
Module Support:
1 E Key M.2
Software MSI PRO B760-P WIFI LGA 1700 ATX Motherboard
OS Compatibility:
Windows 10 to 11 (64-Bit Only)
Physical MSI PRO B760-P WIFI LGA 1700 ATX Motherboard
Form Factor:
ATX
Dimensions:
9.60 x 12.0" / 243.84 x 304.8 mm
Reviews, Questions about MSI PRO B760-P WIFI LGA 1700 ATX
Write Review / Ask a question about MSI PRO B760-P WIFI LGA 1700 ATX
Chinese company Colorful has announced the upcoming release of the iGame X870E VULCAN OC V14 motherboard, aimed at enthusiasts. Distinctive features of this model will be an advanced cooling system and support for high-speed DDR5 memory modules.
GIGABYTE has unveiled the X870E AERO X3D WOOD, the first motherboard with real wood elements. The manufacturer claims that the new product brings comfort and harmony to the workspace. At the same time, the unusual design has not compromised the hardware specifications.
MAXSUN has unveiled one of the most unusual and advanced mATX motherboards based on the AM5 socket - the iCraft X870M. The new product is designed for the next generation of Ryzen processors with a TDP of up to 400W.