Axiom 32GB PC3-14900L (DDR3-1866) ECC LRDIMM - AX31866L13A/32G specs.
Memory modules Specs >> Axiom >> Axiom 32GB PC3-14900L (DDR3-1866) ECC LRDIMM - AX31866L13A/32G| Specifications | | | Reviews |
General Specs Axiom 32GB PC3-14900L (DDR3-1866) ECC LRDIMM - AX31866L13A/32G
Manufacturer:
Axiom Memory Solutions
Manufacturer Part Number:
AX31866L13A/32G
Brand Name:
Axiom
Product Name:
32GB DDR3L SDRAM Memory Module
Product Type:
RAM Module
Detailed Specs Axiom 32GB PC3-14900L (DDR3-1866) ECC LRDIMM - AX31866L13A/32G
Memory Size:
32 GB
Memory Technology:
DDR3LSDRAM
Memory Voltage:
1.50 V
Number of Modules:
1 x 32 GB
Memory Speed:
1866 MHz
Memory Standard:
DDR3-1866/PC3-14900
Error Checking:
ECC
CAS Latency:
CL13
Additional Information Axiom 32GB PC3-14900L (DDR3-1866) ECC LRDIMM - AX31866L13A/32G
Number of Pins:
240-pin
Form Factor:
LRDIMM
Thickness:
0.2" (4.3 mm)
Width:
1.2" (30.4 mm)
Length:
5.3" (133.4 mm)
Miscellaneous Axiom 32GB PC3-14900L (DDR3-1866) ECC LRDIMM - AX31866L13A/32G
Compatibility:
Intel - Server Board DS2600GZ, SuperMicro - SuperServer 2027GR-TRFT, SuperMicro - X9QRi-F+ Motherboard, SuperMicro - X9DRG-QF Motherboard
Green Compliant:
Yes
Green Compliance Certificate/Authority:
RoHS
Reviews, Questions about Axiom 32GB PC3-14900L (DDR3-1866) ECC LRDIMM - AX31866L13A/32G
Write Review / Ask a question about Axiom 32GB PC3-14900L (DDR3-1866) ECC LRDIMM - AX31866L13A/32G
Popular today
Corsair CMK16GX4M2B3000C15
Product Type: DDR4; Form factor: DIMM; The Capacity of one module: 8 Gb; Number of Pins: 288; Number of modules: 2; Memory Speed: 3000 MHz; Bandwidth: 24000 Mb/s; Support ECC: No; ...
Kingston KSE1840/256
Memory type: SDRAM; Form factor: DIMM 168-pin; Clock frequency: 133 MHz; Volume: 1 module 256 MB; ECC support: no; UN-Buffered Memory (Registered): no; Low Profile Bracket (Low Pro...
Another novelty of XPG brand is a series of DDR5 Lancer Neon RAM modules aimed at the gamer audience. In addition to a bright design with RGB lighting, they can boast overclocking support and a proprietary cooling system.
The other day there was a closed presentation of the Semiconductor Engineering Standardization Committee (JEDEC), and information from the event leaked into the network. It was devoted to the development of new memory standards, namely LPDDR6 and DDR6.