Intel Xeon E5-4640V2 Ivy Bridge-EP (2200MHz, LGA2011, L3 20480Kb) specs.
CPU Processors Specs >> Intel >> Intel Xeon E5-4640V2 Ivy Bridge-EP (2200MHz, LGA2011, L3 20480Kb)| Specifications | | | Reviews |
Basic Specs Intel Xeon E5-4640V2 Ivy Bridge-EP (2200MHz, LGA2011, L3 20480Kb)
Socket:
LGA2011
Kernel Intel Xeon E5-4640V2 Ivy Bridge-EP (2200MHz, LGA2011, L3 20480Kb)
The kernel:
Ivy Bridge-EP
Number of cores:
10
The technological process:
22 nm
Frequency characteristics Intel Xeon E5-4640V2 Ivy Bridge-EP (2200MHz, LGA2011, L3 20480Kb)
Clock frequency:
2200 MHz
System bus:
QPI
The voltage at the core of:
0.65 B
Integrated memory controller:
there, the band 59.7 GB/s
Cache Intel Xeon E5-4640V2 Ivy Bridge-EP (2200MHz, LGA2011, L3 20480Kb)
Cache L1:
64 KB
The amount of L2 cache:
2560 KB
Cache L3:
20480 KB
Sets of commands
Support Hyper-Threading Technology:
yes
Instructions:
MMX, SSE, SSE2, SSE3, SSE4
Support for AMD64/EM64T:
yes
Support NX Bit:
yes
Support Virtualization Technology:
yes
Detailed Specs Intel Xeon E5-4640V2 Ivy Bridge-EP (2200MHz, LGA2011, L3 20480Kb)
Typical heat dissipation:
95 W
Maximum operating temperature:
75C
Additional information:
the voltage at the core of 0.65-V
Reviews, Questions about Intel Xeon E5-4640V2 Ivy Bridge-EP (2200MHz, LGA2011, L3 20480Kb)
Write Review / Ask a question about Intel Xeon E5-4640V2 Ivy Bridge-EP (2200MHz, LGA2011, L3 20480Kb)
Popular today
AMD Ryzen 5 4600G 3.7 GHz Six-Core AM4 100-100000147BOX
CPU Model: AMD Ryzen 5 4600G; CPU Socket: AM4; Unlocked: Yes; Number of Cores: 6; Base Clock Speed: 3.7 GHz; Maximum Boost Speed: 4.2 GHz; Thermal Design Power (TDP): 65 W; Included Thermal Solution: ...
Intel Core 2 Duo E4400 2.0 GHz
Manufacturer Part Number: HH80557PG0412M; Model: Intel Core 2 Duo Processor E4400; Number of cores: 2; Clock frequency: 2.0 GHz; L2 Cache: 2 MB; FSB Speed: 800 MHz; Lithography: 65 nm; Socket: LGA 775...
Simultaneously with the announcement of Xbox handheld consoles, AMD has declassified the processors used in the new products: Ryzen AI Z2 Extreme and Ryzen Z2A. The first SoC is notable for its built-in NPU module, while the second is positioned as a more affordable variant with basic characteristics.
Qualcomm is preparing a new generation of flagship processors for notebooks, the official premiere of which is expected only in the fall. However, there is already information about the alleged characteristics of the top chip, which can noticeably raise the performance bar for Windows devices on ARM.
Xiaomi CEO Lei Jun announced XRING O1 - a new processor of its own design. The head of the company did not go into details, but hinted when the first smartphone with this chip will be released.