Mobiles     Laptops     Tablets     Computers     Hardware  Components       Electronics

Iswag Fire specs.

  Mobiles >> iSWAG >> Iswag Fire

Specifications | Reviews | Secret codes
Unlock phone | Root phone
Backup | Flash Firmware | Screenshot



Basic Spec Iswag Fire
Smart Phone OS:?An operating system (OS) is software that interacts between a user and a smartphone.
Android 4.4 KitKat
RAM Memory:
512.0 MB
Display Iswag Fire
Display:
TFT Color (16M), 320x480 px (3.5") 165ppi
Touch screen:
yes
Storage Iswag Fire
Built-in memory:
4 GB
Memory card:
MicroSD/TransFlash max. 32 GB
Camera Iswag Fire
Camera:
1.31 MPx
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
1280 x 1024 px
Flash:
LED
Autofocus:
yes
Optical zoom:
no
Digital zoom:
yes
Second camera:
0.31 Mpx
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
640 x 480 px
Communication Iswag Fire
Bluetooth:?Bluetooth is used to exchange data between nearby mobile devices.
2.1
EDGE:
yes
GPRS:?General Packet Radio Service
yes
GPS:?Global Positioning System
no
A-GPS:?Assisted Global Positioning System
no
GSM:
850 900 1800 1900
HSDPA:?High-Speed Downlink Packet Access
850 1900
USB:?Universal Serial Bus
2.0
WAP:
yes
Wi-Fi:?Wireless lan technology
802.11 b/g/n
Multimedia Iswag Fire
Audio formats:
WAV, MP3, MIDI, AMR, WMA
Audio out:
Jack 3,5 mm
MP3 player:
yes
MP3 ringtones:
yes
Polyphony:
yes
Radio:
yes
RDS:?Radio Data System
yes
RSS:
yes
Vibra:
yes
Dictaphone:
yes
Loudspeaker:
yes
Sensors Iswag Fire
Accelerometer:
yes
Design Iswag Fire
Dual SIM:
yes
SIM card size:
Mini Sim, Micro Sim
Dimensions:
153 x 78.6 x 8.9 mm, vol. 107 cm³
Phone resistant:
no
Battery Iswag Fire
Capacity:
Li-Ion 1300 mAh




Comments, Questions and Answers about Iswag Fire




Ask a question about Iswag Fire
 
  
      10+5= *


news
 Samsung Galaxy Z Fold7 will be the thinnest and lightest clamshell on the market

Samsung has shared new details about the upcoming Galaxy Z Fold7 foldable smartphone. The company has released a teaser hinting at the record-breaking small body thickness of the flagship device.



news
 Honor Magic 8 specs declassified ahead of the announcement

Honor is preparing to release a flagship series of smartphones Magic 8, which, according to insiders, will appear on the Chinese market at the end of the third quarter of this year. The new products will presumably run on the not yet announced chipset Snapdragon 8 Elite 2, the presentation of which is just scheduled for the end of September. Other technical details have also become known.



news
 Vivo Y400 Pro with Sony camera declassified before the presentation

Vivo has not yet announced a ?youth? smartphone Y400 Pro, but the Internet has already appeared on the unofficial list of characteristics of the future novelty. If you believe the insider report, the manufacturer will emphasize the design and photo capabilities of the device.