Mobiles     Laptops     Tablets     Computers     Hardware  Components       Electronics

Samsung S7390 specs.

  Mobiles >> Samsung >> Samsung S7390

Specifications | Reviews | Secret codes
Unlock phone | Root phone | Bypass FRP
Backup | Flash Firmware | Screenshot


Samsung S7390




Basic Spec Samsung S7390
Smart Phone OS:?An operating system (OS) is software that interacts between a user and a smartphone.
Android 4.1.2 Jelly Bean
Processor:
1,00 GHz
RAM memory:
512 MB
Storage Samsung S7390
Internal memory:
4 GB
Memory cards:
microSD, microSDHC, microSDXC, max 64 GB
Display Samsung S7390
Main display:
TFT 16M colors 480 x 800 px (4.00″) 233 ppi
Touchscreen:
Yes
Camera Samsung S7390
Digital camera:
3 Mpx, 2048x1536 px
Video:
MPEG4, H.263, H.264 - 30 fps
Multimedia Samsung S7390
MP3:
Yes
Speakerphone:
Yes
Radio:
Yes
Communication Samsung S7390
Bluetooth:?Bluetooth is used to exchange data between nearby mobile devices.
Yes
NFC:?Near field communication
-
GSM frequencies:
850/900/1800/1900
Standard UMTS:
900/2100
GPS:?Global Positioning System
Yes
GLONASS?GLObal NAvigation Satellite System:
Yes
Wi-Fi:?Wireless lan technology
Yes, v802.11 b/g/n
EDGE:
Yes
GPRS:?General Packet Radio Service
Yes
USB
Yes, v2.0
WAP:
Yes, v2.0
Infrared port (IRDA):?InfraRed Data Association
-
LTE:
-
HSCSD:
-
HSDPA:?High-Speed Downlink Packet Access
Yes
HSPA?High Speed Packet Access :
-
HSPA:
Yes
HSUPA:?High Speed Uplink Packet Access
Yes
Other features Samsung S7390
Calendar:
Yes
Java:
Yes, Dalvik
Watch:
Yes
Design Samsung S7390
Dimensions:
121,5 x 63,1 x 10,85 mm
Weight:
126 g
Battery Samsung S7390
Standard battery:
Li-Ion 1500 mAh
Stand-by (max.):
3G: 350 h
Talk time (max.):
3G: 8 h




Comments, Questions and Answers about Samsung S7390




Ask a question about Samsung S7390
 
  
      2+4= *


Samsung S7390
news
 Samsung Galaxy Z Fold7 will be the thinnest and lightest clamshell on the market

Samsung has shared new details about the upcoming Galaxy Z Fold7 foldable smartphone. The company has released a teaser hinting at the record-breaking small body thickness of the flagship device.



news
 Honor Magic 8 specs declassified ahead of the announcement

Honor is preparing to release a flagship series of smartphones Magic 8, which, according to insiders, will appear on the Chinese market at the end of the third quarter of this year. The new products will presumably run on the not yet announced chipset Snapdragon 8 Elite 2, the presentation of which is just scheduled for the end of September. Other technical details have also become known.



news
 Vivo Y400 Pro with Sony camera declassified before the presentation

Vivo has not yet announced a ?youth? smartphone Y400 Pro, but the Internet has already appeared on the unofficial list of characteristics of the future novelty. If you believe the insider report, the manufacturer will emphasize the design and photo capabilities of the device.