Mobiles     Laptops     Tablets     Computers     Hardware  Components       Electronics

LG LS670 specs.

  Mobiles >> LG >> LG LS670

Specifications | Reviews | Secret codes
Unlock phone | Root phone
Backup | Flash Firmware | Screenshot



General characteristics LG LS670
Type:
Mobile
Battery:
Li-Ion 1500 mAh
CPU:?Central processing unit
600MHz
Smart Phone OS:?An operating system (OS) is software that interacts between a user and a smartphone.
Android 2.2
Dimensions:
114 x 59 x 13 mm
Formfactor:
Bar
Keyboard:
Screen
Weight:
115 g
Display LG LS670
Color:
Yes
Colors:
16M
Other:
Capacitive, Touch, Multitouch
Pixel aspect ratio:
1.0
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
320x480
Display PPI:
180
Screen Size:?This diagonal display size is usually measured in inches.
3.2
Type:
TFT
Audio:
MP3, AAC, AAC+, WMA
Camera:
3.15MP, 2048x1536
Other:
Auto focus
Videocapture:
VGA
Videoplayback:
MPEG4, WMV, 3GP, 3G2
Other functions LG LS670
Connectors:
USB 2.0, MicroUSB, 3.5mm Audio
Network:
CDMA800, CDMA1900, Bluetooth 2.1, 802.11b, 802.11g
Features:
Caller groups, Multiple numbers per contact, Search by both first and last name, Picture ID, Ring ID, Calendar, Alarm, Document viewer, Calculator, Computer sync, OTA sync, Haptic feedback, Music ringtones (MP3), Polyphonic ringtones (72 voices), Vibration, Flight mode, Silent mode, Speakerphone, Voice dialing (Speaker independent), Voice commands (Speaker independent), Voice recording, TTY/TDD, Accelerometer, Compass, SMS, Threaded viewer, MMS, Email, Push Email, IM, Social networking integration, Google Search, Maps, Gmail, YouTube, Google Talk, Picasa, Organizer, Voice memo, Predictive text input, Games
Memory Internal:
140MB
Memory Slot:
microSD, microSDHC, 32GB




Comments, Questions and Answers about LG LS670




Ask a question about LG LS670
 
  
      5+8= *


news
 Samsung Galaxy Z Fold7 will be the thinnest and lightest clamshell on the market

Samsung has shared new details about the upcoming Galaxy Z Fold7 foldable smartphone. The company has released a teaser hinting at the record-breaking small body thickness of the flagship device.



news
 Honor Magic 8 specs declassified ahead of the announcement

Honor is preparing to release a flagship series of smartphones Magic 8, which, according to insiders, will appear on the Chinese market at the end of the third quarter of this year. The new products will presumably run on the not yet announced chipset Snapdragon 8 Elite 2, the presentation of which is just scheduled for the end of September. Other technical details have also become known.



news
 Vivo Y400 Pro with Sony camera declassified before the presentation

Vivo has not yet announced a ?youth? smartphone Y400 Pro, but the Internet has already appeared on the unofficial list of characteristics of the future novelty. If you believe the insider report, the manufacturer will emphasize the design and photo capabilities of the device.