Mobiles     Laptops     Tablets     Computers     Hardware  Components       Electronics

LG Envoy specs.

  Mobiles >> LG >> LG Envoy

Specifications | Reviews | Secret codes


LG Envoy




Design LG Envoy
Device type:
Basic phone
Form factor:
Clamshell
Dimensions:
3.76 x 1.94 x 0.70 inches (96 x 49 x 18 mm)
Weight:
3.39 oz (96 g)
the average is 4.8 oz (137 g)
Design features:
Soft keys, D-Pad
Colors:
Black
Display LG Envoy
Physical size:
2.2 inches
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
176 x 220 pixels
Pixel density:
128 ppi
Technology:
TFT
Screen-to-body ratio:
32.37 %
Colors:
262 144
Additional display:
Greyscale
Resolution:
96 x 64 pixels
Physical Size:
0.98 inches
Camera LG Envoy
Camera:
0.3 megapixels VGA
Hardware LG Envoy
Built-in storage:
0.024 GB
Battery LG Envoy
Talk time:
6.00 hours
the average is 11 h (675 min)
Stand-by time:
20.0 days (480 hours)
the average is 20 days (477 h)
Capacity:
1000 mAh
Internet browsing LG Envoy
Browser supports:
WAP
Technology LG Envoy
CDMA :
800, 1900 MHz
Positioning :
E911
Phone features LG Envoy
Organizer:
Calendar, Alarm
Messaging:
SMS, Predictive text input
JAVA:
Yes
Games:
Yes
Connectivity LG Envoy
Bluetooth:?Bluetooth is used to exchange data between nearby mobile devices.
2.1, EDR
USB:?Universal Serial Bus
Yes
Connector:
microUSB
Charging connector:
microUSB
Other features LG Envoy
Hearing aid compatibility:
M4
Regulatory Approval LG Envoy
FCC approval :
 
Date approved:
31 Mar 2011
FCC ID value: BEJUN150
FCC measured SAR :
 
Head:
1.09 W/kg
Measured in:
1900 MHz
Body:
0.51 W/kg
Measured in:
1900 MHz




Comments, Questions and Answers about LG Envoy




Ask a question about LG Envoy
 
  
      6+3= *


LG Envoy
news
 Samsung Galaxy Z Fold7 will be the thinnest and lightest clamshell on the market

Samsung has shared new details about the upcoming Galaxy Z Fold7 foldable smartphone. The company has released a teaser hinting at the record-breaking small body thickness of the flagship device.



news
 Honor Magic 8 specs declassified ahead of the announcement

Honor is preparing to release a flagship series of smartphones Magic 8, which, according to insiders, will appear on the Chinese market at the end of the third quarter of this year. The new products will presumably run on the not yet announced chipset Snapdragon 8 Elite 2, the presentation of which is just scheduled for the end of September. Other technical details have also become known.



news
 Vivo Y400 Pro with Sony camera declassified before the presentation

Vivo has not yet announced a ?youth? smartphone Y400 Pro, but the Internet has already appeared on the unofficial list of characteristics of the future novelty. If you believe the insider report, the manufacturer will emphasize the design and photo capabilities of the device.