Mobiles     Laptops     Tablets     Computers     Hardware  Components       Electronics

Hi-Tech Super X9 specs.

  Mobiles >> Hi-Tech >> Hi-Tech Super X9

Specifications | Reviews | Secret codes


Hi-Tech Super X9




General Information Hi-Tech Super X9
Sim Type:
GSM+GSM
Dual Sim:
Yes
Device Type:
Budget Phone
Release Date:
October, 2012
Display Hi-Tech Super X9
Type:
Color LCD screen
Touchscreen:
No
Size:
1.8 inches, 128 x 160 pixels
PPI:
~ 114 PPI
Memory Hi-Tech Super X9
Card Slot:
Yes, upto 8 GB
Connectivity Hi-Tech Super X9
GPRS:?General Packet Radio Service
Yes
EDGE:
No
3G:?Third generation cellular network
No
Wi-Fi:?Wireless lan technology
No
Bluetooth:?Bluetooth is used to exchange data between nearby mobile devices.
Yes
USB:?Universal Serial Bus
Yes
Camera Hi-Tech Super X9
Camera:
Yes, VGA (0.3 MP)
Dual Camera:
No
Features:
Smile detection
Front Camera:
No
Multimedia Hi-Tech Super X9
FM Radio:
Yes
Battery Hi-Tech Super X9
Size:
1200 mAh, Li-ion Battery




Comments, Questions and Answers about Hi-Tech Super X9




Ask a question about Hi-Tech Super X9
 
  
      2+10= *


Hi-Tech Super X9
news
 Budget ZTE Blade A76 with dual AI camera and 5G support released

ZTE Blade smartphone lineup has a new low-cost model - ZTE Blade A76. The novelty has advanced shooting capabilities due to the integration of AI, large memory capacity, support for 5G and a rugged body with IP54 protection.



news
 Nubia Red Magic 10S Pro with PC gaming support has hit the global market

The new flagship smartphone Red Magic 10S Pro has become available on the global market. The device is aimed at mobile gamers and offers top-end hardware, active cooling and an impressive battery, and the main highlight is a built-in emulator that allows you to run full PC games.



news
 Specifications of vivo T4 Ultra camera phone confirmed officially

Shortly before the premiere of the T4 Ultra smartphone, vivo published promotional materials dedicated to the novelty. They revealed the key hardware characteristics of the gadget, including the model of its processor and the features of the camera module.