ECS motherboards specifications.
Motherboards Specs >> ECSECS H110M-C3D |
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 | Form Factor: microATX Socket: LGA1151 Number of sockets: 1 Integrated processor: No |
 ECS H110M-C3D |
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ECS BSWI-D2-N3050M |
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 | Form Factor: mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS BSWI-D2-N3050M |
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ECS BSWI-D2-N3150 |
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 | Form Factor: mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS BSWI-D2-N3150 |
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ECS BAT-I2 (V2.0) |
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 | Form Factor: mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS BAT-I2 (V2.0) |
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ECS BSWI-D (V1.0A) |
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 | Form Factor: mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS BSWI-D (V1.0A) |
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ECS BAT-I2 (V1.0) |
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 | Form Factor: mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS BAT-I2 (V1.0) |
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ECS BAT-I3 (V1.0) |
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 | Form Factor: mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS BAT-I3 (V1.0) |
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ECS BAT-TI2 (V1.0) |
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 | Form Factor: thin mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS BAT-TI2 (V1.0) |
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ECS BAT-TI (V1.0) |
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 | Form Factor: thin mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS BAT-TI (V1.0) |
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ECS P67H2-A2 (V1.0) |
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 | Form Factor: ATX Socket: LGA1155 Number of sockets: 1 Integrated processor: No |
| ECS P67H2-A2 (V1.0) |
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ECS Q77H2-TI (V1.0A) |
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 | Form Factor: thin mini-ITX Socket: LGA1155 Number of sockets: 1 Integrated processor: No |
| ECS Q77H2-TI (V1.0A) |
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ECS BSWI-D2-N3050 |
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 | Form Factor: mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS BSWI-D2-N3050 |
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ECS BSWI-D2-N3700 |
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 | Form Factor: mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS BSWI-D2-N3700 |
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ECS KAM1-I (V1.0) |
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 | Form Factor: mini-ITX Socket: AM1 Number of sockets: 1 Integrated processor: No |
| ECS KAM1-I (V1.0) |
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ECS NM70-I3 (V1.0A) |
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 | Form Factor: mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS NM70-I3 (V1.0A) |
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ECS Z97I-DRONE (V1.0A) |
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 | Form Factor: mini-ITX Socket: LGA1150 Number of sockets: 1 Integrated processor: No |
| ECS Z97I-DRONE (V1.0A) |
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ECS B75H2-TI (V1.0A) |
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 | Form Factor: thin mini-ITX Socket: LGA1155 Number of sockets: 1 Integrated processor: No |
| ECS B75H2-TI (V1.0A) |
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ECS H81H3-M4 (V1.0A) |
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 | Form Factor: mini-DTX Socket: LGA1150 Number of sockets: 1 Integrated processor: No |
| ECS H81H3-M4 (V1.0A) |
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ECS A75F2-M2 (V1.0A) |
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 | Form Factor: microATX Socket: FM2 Number of sockets: 1 Integrated processor: No |
| ECS A75F2-M2 (V1.0A) |
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ECS CDC-TI (V1.0A) |
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 | Form Factor: thin mini-ITX Number of sockets: 1 Integrated processor: Yes |
| ECS CDC-TI (V1.0A) |
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Sapphire has released its first 800 series motherboard - B850M NITRO+. The new motherboard features a Micro-ATX form factor, AM5 socket and supports DDR5-8000 memory.
ASRock has introduced the B650M PRO X3D and PRO X3D WiFi motherboards. They are positioned as affordable models optimized for Ryzen X3D series processors and are simplified versions of more expensive models.
Colorful has revealed a line of motherboards based on Intel B860 chip. It includes three models: iGame B860M ULTRA, CVN B860M GAMING FROZEN and B860I GAMING FROZEN. All new products support DDR5 memory, PCIe Gen 5 drives, high-speed USB 4 ports and other advanced technologies.