Sony Vaio EB VPCEB15FH VPCEB15FH/P specs.
Laptops Specs >> Sony >> Sony Vaio EB VPCEB15FH VPCEB15FH/P| Specifications | | | Reviews | | | Useful keys |
Operating System Sony VAIO EB VPCEB15FH VPCEB15FH/P
Operating system:
Windows 7 Home Premium
Operating system architecture:
64-bit
Processor Sony VAIO EB VPCEB15FH VPCEB15FH/P
Processor manufacturer:
Intel
Processor generation:
3rd gen Intel® Core™ i3
Processor model:
i3-330M
Processor frequency:
2.13 GHz
Processor family:
Intel® Core™ i3
Processor cores:
2
Processor threads:
4
Processor cache:
3 MB
Processor cache type:
Smart Cache
Processor socket:
BGA 1288
Processor operating modes:
64-bit
Processor series:
Intel Core i3-300 Mobile Series
Processor codename:
Arrandale
Memory Sony VAIO EB VPCEB15FH VPCEB15FH/P
Internal memory:
4 GB
Internal memory type:
DDR3-SDRAM
Memory slots:
2x SO-DIMM
Maximum internal memory:
8 GB
Hard Drive & Optical Drive Sony VAIO EB VPCEB15FH VPCEB15FH/P
Total storage capacity:
320 GB
Storage media:
HDD
Number of HDD installed:
1
HDD capacity:
320 GB
HDD interface:
SATA
HDD speed:
5400 RPM
Optical drive type:
DVD Super Multi
Card reader integrated:
Yes
Compatible memory cards:
MS Duo,MS Pro-HG,SD,SDHC
Display & Graphics Sony VAIO EB VPCEB15FH VPCEB15FH/P
Display diagonal:
39.4 cm (15.5")
Display resolution:
1366 x 768 pixels
Touchscreen:
No
LED backlight:
Yes
Native aspect ratio:
16:9
Discrete graphics adapter model:
AMD Mobility Radeon HD 5470
On-board graphics adapter:
Yes
Discrete graphics adapter:
Yes
On-board graphics adapter family:
Intel® HD Graphics
On-board graphics adapter model:
Intel® HD Graphics
Discrete graphics adapter memory:
0.512 GB
Discrete graphics memory type:
GDDR3
Built-in Devices Sony VAIO EB VPCEB15FH VPCEB15FH/P
Front camera resolution:
0.3 MP
Interfaces Sony VAIO EB VPCEB15FH VPCEB15FH/P
Total Number USB 2.0 ports:
3
eSATA/USB 2.0 ports quantity:
1
Ethernet LAN (RJ-45) ports:
1
HDMI ports quantity:
High Definition Multimedia Interface
High Definition Multimedia Interface1
DVI port:Digital Visual Interface
Digital Visual InterfaceNo
Total Number VGA (D-Sub) ports:
1
Headphone outputs:
1
S/PDIF out port:Sony/Philips Digital Interface
Sony/Philips Digital InterfaceNo
Microphone in:
Yes
Docking connector:
No
ExpressCard slot:
Yes
CardBus PCMCIA slot type:Personal Computer Memory Card International Association
Personal Computer Memory Card International AssociationNo
SmartCard slot:
No
Network Sony VAIO EB VPCEB15FH VPCEB15FH/P
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.Yes
Wi-Fi:Wireless lan technology
Wireless lan technologyYes
Wi-Fi standards:
802.11b,802.11g,Wi-Fi 4 (802.11n)
Ethernet LAN:
Yes
Ethernet LAN data rates:
10,100,1000 Mbit/s
Bluetooth version:
2.1 EDR
Input Devices Sony VAIO EB VPCEB15FH VPCEB15FH/P
Pointing device:
Touchpad
Audio Sony VAIO EB VPCEB15FH VPCEB15FH/P
Audio system:
Intel High Definition Audio
Built-in speaker(s):
Yes
Built-in microphone:
Yes
Battery Sony VAIO EB VPCEB15FH VPCEB15FH/P
Battery technology:
Lithium-Ion (Li-Ion)
Physical Characteristics Sony VAIO EB VPCEB15FH VPCEB15FH/P
Product colour:
Pink
Width:
369.8 mm
Depth:
248.2 mm
Height (front):
3.11 cm
Height (rear):
3.67 cm
Reviews, Questions about Sony Vaio EB VPCEB15FH VPCEB15FH/P
Write Review / Ask a question about Sony Vaio EB VPCEB15FH VPCEB15FH/P
iFixit experts took apart the Lenovo ThinkPad T14 G7 and ThinkPad T16 G5 laptops to assess their repairability. It appears that Lenovo has begun to fulfill its long-standing promise: both new models received the highest score on the company's proprietary repair difficulty rating scale.
Hefei LCFC Information Technology held a presentation of its AI Plus concept device. It is a modular laptop based on a device with a flexible screen and equipped with a separate unit containing a graphics card and a liquid cooler, which can be used together or separately.
A product page for the new 14-inch Xiaomi Book Pro 14 laptop has appeared on the company's official website. The manufacturer has confirmed the key technical specifications of the upcoming device and showcased its design features.