Mobiles     Laptops     Tablets     Computers     Hardware  Components       Electronics

Cubot GT72 plus specs.

  Mobiles >> Cubot >> Cubot GT72 plus

Specifications | Reviews | Secret codes
Unlock phone | Root phone
Backup | Flash Firmware | Screenshot


Cubot GT72 plus




Basic Spec Cubot GT72 plus
Smart Phone OS:?An operating system (OS) is software that interacts between a user and a smartphone.
Android 4.4 KitKat
Processor:
MediaTek MT6572M 1,00 GHz
Number of cores: 2
GPU:?Graphics Processing Unit
ARM Mali-400 MP1 @500 MHz
RAM memory:
512 MB
DualSIM:
Yes
Storage Cubot GT72 plus
Internal memory:
4 GB
Memory cards:
microSD, microSDHC, max 32 GB
Display Cubot GT72 plus
Main display:
TFT 256k colors 480 x 800 px (4.00″) 233 ppi
Touchscreen:
Yes
Camera Cubot GT72 plus
Digital camera:
2 Mpx, 1600x1200 px
Flash:
Yes, LED
Secondary camera:
0.3 Mpx, 640x480 px
Video:
H.263, H.264, MPEG4
Multimedia Cubot GT72 plus
MP3:
Yes
Speakerphone:
Yes
Radio:
Yes
Communication Cubot GT72 plus
Bluetooth:?Bluetooth is used to exchange data between nearby mobile devices.
Yes
NFC:?Near field communication
-
GSM frequencies:
850/900/1800/1900
Standard UMTS:
850/2100
GPS:?Global Positioning System
-
GLONASS?GLObal NAvigation Satellite System:
-
Wi-Fi:?Wireless lan technology
Yes, v802.11 b/g
EDGE:
Yes
GPRS:?General Packet Radio Service
Yes
USB
Yes, v2.0
WAP:
Yes
Infrared port (IRDA):?InfraRed Data Association
-
LTE:
-
HSCSD:
-
HSDPA:?High-Speed Downlink Packet Access
Yes
HSPA?High Speed Packet Access :
-
HSPA:
-
HSUPA:?High Speed Uplink Packet Access
-
Other features Cubot GT72 plus
Calendar:
Yes
Java:
Yes, Dalvik
Watch:
Yes
Design Cubot GT72 plus
Dimensions:
126 x 65,17 x 8,75 mm
Battery Cubot GT72 plus
Standard battery:
Li-Ion 1350 mAh




Comments, Questions and Answers about Cubot GT72 plus




Ask a question about Cubot GT72 plus
 
  
      2+8= *


Cubot GT72 plus
news
 Samsung Galaxy Z Fold7 will be the thinnest and lightest clamshell on the market

Samsung has shared new details about the upcoming Galaxy Z Fold7 foldable smartphone. The company has released a teaser hinting at the record-breaking small body thickness of the flagship device.



news
 Honor Magic 8 specs declassified ahead of the announcement

Honor is preparing to release a flagship series of smartphones Magic 8, which, according to insiders, will appear on the Chinese market at the end of the third quarter of this year. The new products will presumably run on the not yet announced chipset Snapdragon 8 Elite 2, the presentation of which is just scheduled for the end of September. Other technical details have also become known.



news
 Vivo Y400 Pro with Sony camera declassified before the presentation

Vivo has not yet announced a ?youth? smartphone Y400 Pro, but the Internet has already appeared on the unofficial list of characteristics of the future novelty. If you believe the insider report, the manufacturer will emphasize the design and photo capabilities of the device.