Asus ZenFone 3 Max 5.5 ZC553KL specs.
Mobiles >> ASUS >> Asus ZenFone 3 Max 5.5 ZC553KL| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
Design Asus ZenFone 3 Max 5.5 ZC553KL
Colors:
Golden, Gray, Pink, Silver
Dimensions:
151.4 x 76.2 x 8.3 mm
Weight:
175g
Network Asus ZenFone 3 Max 5.5 ZC553KL
2G:
Second generation cellular network
Second generation cellular networkGSM 850, GSM 900, GSM 1800, GSM 1900
4G:Fourth generation cellular network
Fourth generation cellular networkLTE 700, LTE 2300, LTE 1900, LTE 900, LTE 1700, LTE 850, LTE 2600, LTE 1800, LTE 800, LTE 2100, LTE 2500
SIM:
Hybrid Dual Sim, (Micro Sim Nano Sim)
Display Asus ZenFone 3 Max 5.5 ZC553KL
Type:
IPS LCD Capacitive TouchScreen (Asus Tru2Life,Eye Care,450 nits Brightness)
Display Colors:
16M Colors
Size:
5.5 Inch
Screen-to-body ratio:
~73% screen-to-body-ratio
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels1080 x 1920 pixels
Pixel Density:
~401 ppi
Protection:
Corning Gorilla Glass, (2.5D Arc Glass)
Camera Asus ZenFone 3 Max 5.5 ZC553KL
Primary:
16 Megapixels 4608 x 3456 Pixels
Flash:
Dual-LED Flash, (Dual Tone Flash)
Video Recording:
With 1080p
Secondary:
8.0 Megapixels, (F2.2 Aperture,4P Lens,Manual Mode)
Camera Flash:
No
Camera Features:
Autofocus, PDAF Sensor, Gesture Shot, Laser Auto Focus, Voice Capture, Face Beauty, HDR, Smile detection, Face Detection, Self timer, Touch focus, Low Light Mode, Pixel Master 3.0,Manual Mode,Time Lapse,F2.0 Aperture,TriTech Focus
Media Asus ZenFone 3 Max 5.5 ZC553KL
Audio Playback:
WAV, AAC , OGG, FLAC, MIDI, WMA, M4A, MP3, AMR, AAC, eAAC
Ring Tones:
Vibration, MP3 ringtones, WAV
FM Radio:
Yes
3.5mm jack:
Yes
Software Asus ZenFone 3 Max 5.5 ZC553KL
Smart Phone OS:An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android 6.0 (Marshmallow), (Zen UI 3.0)
Hardware Asus ZenFone 3 Max 5.5 ZC553KL
Chipset:Is a set of chips in the smartphone that control the CPU.
Is a set of chips in the smartphone that control the CPU.Qualcomm Snapdragon 430
CPU:Central processing unit
Central processing unit1.4 GHz Octa Core Processor
GPU:Graphics Processing Unit
Graphics Processing UnitAdreno 505
RAM:Random Access Memory
Random Access Memory3 GB, 2 GB, 4 GB
Internal Storage:
32 GB
Card Slot:
MicroSD (Uses Sim 2 Slot) Upto 128 GB
Sensors:
Proximity Sensor, Accelerometer, Compass, Ambient Light, Gyro, Fingerprint, Hall Effect
Connectivity Asus ZenFone 3 Max 5.5 ZC553KL
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.Bluetooth 4.1, With EDR, A2DP
Wi-Fi:Wireless lan technology
Wireless lan technologyWi-Fi 802.11 a/b/g/n/ac, Wi-Fi Direct
GPS:Global Positioning System
Global Positioning Systemwith A-GPSAssisted Global Positioning System support, GLONASSGLObal NAvigation Satellite System, BDS
Assisted Global Positioning System support, GLONASSGLObal NAvigation Satellite System, BDSUSB:Universal Serial Bus
Universal Serial BusmicroUSB 2.0, (OTG, Reverse Charging Mode)
NFC:Near field communication
Near field communicationNo
Other:
Yes
Data Asus ZenFone 3 Max 5.5 ZC553KL
Speed:
HSPAHigh Speed Packet Access plus, LTE
High Speed Packet Access plus, LTEWeb Browser:
Google Chrome Browser
Battery Asus ZenFone 3 Max 5.5 ZC553KL
Battery Type:
Li-Po 4100 mAh
Wireless Charging:
No
Quick Charge:
Yes
Talk Time:
22 Hrs, Unofficial
Music Play:
Up to 90 Hrs
Features:
790 Hrs, Up to 792 Hrs
Comments, Questions and Answers about Asus ZenFone 3 Max 5.5 ZC553KL
Ask a question about Asus ZenFone 3 Max 5.5 ZC553KL
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.