Foxconn H55MXV LE specs
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Processor Foxconn H55MXV LE
Socket:
LGA1156 package
Processors supported:
Intel Core i7/Core i5/Core i3
Support for multi-core processors:
yes
Chipset Foxconn H55MXV LE
Chipset:
Intel H55
SLI/CrossFire:
Scalable Link Interface
Scalable Link Interfaceno
Memory Foxconn H55MXV LE
Memory:
DDR3 DIMM 800 - 1333 MHz
Number of memory slots:
2
Supports dual channel mode:
yes
Maximum memory:
8 GB
Disk controllers Foxconn H55MXV LE
IDE:Integrated Drive Electronics
Integrated Drive Electronicsno
SATA:Serial Advanced Technology Attachment
Serial Advanced Technology Attachmentnumber of connectors SATA 3Gb/s: 6
Expansion slots Foxconn H55MXV LE
Expansion slots:
1xPCI-E x16, 1xPCI-E x1, 2xPCI
PCI Express 2.0 support:
yes
Audio/video Foxconn H55MXV LE
Sound:
5.1CH, HDA, based on the Realtek ALC662
Network Foxconn H55MXV LE
Ethernet:
1000 Mbps, based on the Realtek 8111DL
Connection Foxconn H55MXV LE
Interfaces:
10 USB, S/PDIF output D-Sub, DVI, Ethernet, PS/2 (keyboard), PS/2 (mouse)
Back panel connectors:
4 USB, D-Sub, DVI, Ethernet, PS/2 (keyboard), PS/2 (mouse)
Main power connector:
24-pin
Processor power connector:
4-pin
Advanced settings Foxconn H55MXV LE
Form factor:
microATX
Comments, Questions and Answers about Foxconn H55MXV LE
| Barış | January 17, 2021 | |
| 4 gb 2 tane ddr 3 1333 mhz ram uyar mı | ||
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