Mobiles     Laptops     Tablets     Computers     Hardware  Components       Electronics

Hewlett Packard Enterprise 8GB Fully Buffered DIMM PC2-5300 2x4GB Low Power DDR2 Memory Kit 667 MHz 466440-B21-RFB specs.

  Memory modules Specs >> HP >> Hewlett Packard Enterprise 8GB Fully Buffered DIMM PC2-5300 2x4GB Low Power DDR2 Memory Kit 667 MHz 466440-B21-RFB
Specifications | Reviews


Features Hewlett Packard Enterprise 8GB Fully Buffered DIMM PC2-5300 2x4GB Low Power DDR2 Memory Kit 667 MHz 466440-B21-RFB
Memory form factor:
240-pin DIMM
Memory clock speed:
667 MHz
Internal memory type:
DDR2
Memory layout (modules x size):
2 x 4 GB
Internal memory:
8 GB
Packaging data Hewlett Packard Enterprise 8GB Fully Buffered DIMM PC2-5300 2x4GB Low Power DDR2 Memory Kit 667 MHz 466440-B21-RFB
Package type:
DIMM?Dual In-line Memory Module
Weight & dimensions Hewlett Packard Enterprise 8GB Fully Buffered DIMM PC2-5300 2x4GB Low Power DDR2 Memory Kit 667 MHz 466440-B21-RFB
Weight:
567 g
Height:
177.8 mm
Depth:
114.3 mm
Width:
25.4 mm


Reviews, Questions about Hewlett Packard Enterprise 8GB Fully Buffered DIMM PC2-5300 2x4GB Low Power DDR2 Memory Kit 667 MHz 466440-B21-RFB




Write Review / Ask a question about Hewlett Packard Enterprise 8GB Fully Buffered DIMM PC2-5300 2x4GB Low Power DDR2 Memory Kit 667 MHz 466440-B21-RFB
 
  
      1+5= *


Popular today


Kingston KVR16N11S8/4-SP
Kingston KVR16N11S8/4-SP
Product Type: DDR3; Form factor: DIMM; The Capacity of one module: 4 Gb; Number of modules: 1; Memory Speed: 1600 MHz; Bandwidth: 12800 Mb/s; Support ECC: No; CL: 11; tRCD: 11; tRP...
OCZ OCZ3G1600LV2G
OCZ OCZ3G1600LV2G
Memory type: DDR3; Form factor: DIMM 240-pin; Clock frequency: 1600 MHz; Bandwidth: 12800 MB/s; Volume: 1 module 2 GB; ECC support: no; UN-Buffered Memory (Registered): no; Low Pro...




Hewlett Packard Enterprise 8GB Fully Buffered DIMM PC2-5300 2x4GB Low Power DDR2 Memory Kit 667 MHz 466440-B21-RFB
news
 Potential speeds for LPDDR6 and DDR6 memory are named

The other day there was a closed presentation of the Semiconductor Engineering Standardization Committee (JEDEC), and information from the event leaked into the network. It was devoted to the development of new memory standards, namely LPDDR6 and DDR6.