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Axiom 8GB DDR2-667 ECC FBDIMM Kit (2 x 4GB) for HP # 397415-B21 - 397415-B21-AX specs.

  Memory modules Specs >> Axiom >> Axiom 8GB DDR2-667 ECC FBDIMM Kit (2 x 4GB) for HP # 397415-B21 - 397415-B21-AX
Specifications | Reviews


General Specs Axiom 8GB DDR2-667 ECC FBDIMM Kit (2 x 4GB) for HP # 397415-B21 - 397415-B21-AX
Manufacturer:
Axiom Memory Solutions
Manufacturer Part Number:
397415-B21-AX
Brand Name:
Axiom
Product Name:
8GB DDR2 SDRAM Memory Module
Product Type:
RAM Module
Detailed Specs Axiom 8GB DDR2-667 ECC FBDIMM Kit (2 x 4GB) for HP # 397415-B21 - 397415-B21-AX
Memory Size:
8 GB
Memory Technology:
DDR2SDRAM
Number of Modules:
2 x 4 GB
Memory Speed:
667 MHz
Error Checking:
ECC
Signal Processing:
Fully Buffered
Additional Information Axiom 8GB DDR2-667 ECC FBDIMM Kit (2 x 4GB) for HP # 397415-B21 - 397415-B21-AX
Number of Pins:
240-pin
Form Factor:
DIMM?Dual In-line Memory Module
Thickness:
0.3" (7.7 mm)
Width:
1.2" (30.4 mm)
Length:
5.3" (133.4 mm)
Weight (Approximate):
46.7 g
Miscellaneous Axiom 8GB DDR2-667 ECC FBDIMM Kit (2 x 4GB) for HP # 397415-B21 - 397415-B21-AX
Compatibility:
HP-Compaq - ProLiant ML350 G5, HP-Compaq - Workstation xw8400, HP-Compaq - ProLiant BL20p G4 Server Blade, HP-Compaq - ProLiant BL460c Server Blade, HP-Compaq - ProLiant BL480c Server Blade, HP-Compaq - ProLiant DL140 G3, HP-Compaq - ProLiant xw460c Blade Workstation, HP-Compaq - ProLiant DL580 G5, HP-Compaq - Workstation xw6600, HP-Compaq - Workstation xw8600, HP-Compaq - ProLiant DL160 G5, HP-Compaq - ProLiant DL160 G5p, HP-Compaq - ProLiant DL580 G5 Highly Serviceable Tower, HP-Compaq - ProLiant ML150 G3, HP-Compaq - ProLiant ML370 G5, HP-Compaq - Workstation xw6400, HP-Compaq - ProLiant DL380 G5, HP-Compaq - ProLiant DL360 G5, HP-Compaq - ProLiant BL680c G5
Warranty Axiom 8GB DDR2-667 ECC FBDIMM Kit (2 x 4GB) for HP # 397415-B21 - 397415-B21-AX
Limited Warranty:
Lifetime


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Axiom 8GB DDR2-667 ECC FBDIMM Kit (2 x 4GB) for HP # 397415-B21 - 397415-B21-AX
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 Potential speeds for LPDDR6 and DDR6 memory are named

The other day there was a closed presentation of the Semiconductor Engineering Standardization Committee (JEDEC), and information from the event leaked into the network. It was devoted to the development of new memory standards, namely LPDDR6 and DDR6.