Honor Magic 8 specs declassified ahead of the announcement |
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Honor is preparing to release a flagship series of smartphones Magic 8, which, according to insiders, will appear on the Chinese market at the end of the third quarter of this year. The new products will presumably run on the not yet announced chipset Snapdragon 8 Elite 2, the presentation of which is just scheduled for the end of September. Other technical details have also become known. According to Chinese insider Digital Chat Station, one of the Honor Magic 8 prototypes received a flat 6.58-inch screen with 1.5K resolution and 2.5D glass rounded at the edges. It is also reported to have ultra-thin bezels - less than 1mm - and an under-screen ultrasonic fingerprint scanner. In addition, the corners of the display will have a large radius of curvature. The source also claims support for wireless charging and IP68  IP (or "Ingress Protection") ratings are defined in international standard EN 60529 (British BS EN 60529:1992, European IEC 60509:1989). They are used to define levels of sealing effectiveness of electrical enclosures against intrusion from foreign bodies (tools, dirt etc) and moisture. The numbers that follow IP each have a specific meaning. The first indicates the degree of protection (of people) from moving parts, as well as the protection of enclosed equipment from foreign bodies. The second defines the protection level that the enclosure enjoys from various forms of moisture (drips, sprays, submersion etc). or even IP69 water and dust protection. Unexpectedly for the base model in the series, the prototype features a telecamera with a periscopic lens. In comparison, the regular Magic 7 had a conventional telephoto camera with a 3x zoom lens, and the periscope was only used in the older models. |
