effire - specifications phones
Mobiles >> effireeffire A7 |
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 | Resolution: 4416x2944px Display: LCD IPSColor (16M) 720x1280px (5.0") 294ppi System chip: MediaTek MT8732 Dimensions: 144 x 71.3 x 9.4 mm, vol. 96 cm³ Battery capacity: Li-Ion 2500 mAh |
 effire A7Secret codes for effire A7 |
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effire CityPhone Astra Z1 |
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 | Screen Size: 480x854 Processor: MediaTek MT6572, 1200 MHz System memory: 512 MB Internal Memory: 4 GB Dimensions: 70x137x7 mm Battery capacity: 2600 mAh |
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effire CityPhone Astra |
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 | Screen Size: 480x800 Processor: MediaTek MT6577, 1200 MHz System memory: 1 GB Internal Memory: 4 GB Dimensions: 67x127x10.6 mm Battery capacity: 1500 mAh |
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effire CityPhone Lion |
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 | Screen Size: 720x1280 Processor: MediaTek MT6589, 1200 MHz System memory: 1 GB Internal Memory: 8 GB Dimensions: 83x155x9 mm Battery capacity: 3200 mAh |
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effire CityPhone Nova |
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 | Screen Size: 320x480 Processor: MediaTek MT6575, 1000 MHz System memory: 256 MB Internal Memory: 4 GB Dimensions: 63x118x10.8 mm Battery capacity: 1200 mAh |
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effire CityPhone CY-85 |
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 | Screen Size: 320x480 Processor: 1000 MHz System memory: 512 MB Internal Memory: 4 GB Dimensions: 62x114x12.5 mm Battery capacity: 1300 mAh |
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effire CityPhone CY-100 |
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 | Screen Size: 480x800 Processor: MediaTek MT6572, 1200 MHz System memory: 512 MB Internal Memory: 4 GB Dimensions: 64x125x12 mm Battery capacity: 1550 mAh |
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Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.