Xelectron W007 Plus specs.
Mobiles >> Xelectron >> Xelectron W007 Plus| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
General Information Xelectron W007 Plus
Smart Phone OS:
An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android v4.0.4 (Ice Cream Sandwich)
SIM Slot(s):
Single SIM, GSM
SIM Size:
SIM1: Mini
Network:
4G: Not Available, 3G: Available, 2G: Available
Body Xelectron W007 Plus
Colours:
White
Display Xelectron W007 Plus
Screen Size:This diagonal display size is usually measured in inches.
This diagonal display size is usually measured in inches.7.0 inches
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels480 x 800 pixels
Pixel Density:
133 ppi
Display Type:
LCD
Touch Screen:
Capacitive Touchscreen, Multi-touch
Performance Xelectron W007 Plus
Processor:
Dual core, 1.2 GHz
Graphics:
Mali-400
RAM:Random Access Memory
Random Access Memory512 MB
Memory Xelectron W007 Plus
Internal Memory:
8 GB
Expandable Memory:
Up to 32 GB
Camera Xelectron W007 Plus
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels1.3 MP
Image Resolution:
1280 x 1024 Pixels
Camera Features:
Digital Zoom
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels0.3 MP
Battery Xelectron W007 Plus
Battery capacity:
4200 mAh
Type:
Li-Polymer
Not User Replaceable:
Yes
Connectivity Xelectron W007 Plus
SIM Size:
SIM1: Mini
Network Support:
3G, 2G
SIM 1:
3G Bands: UMTS 2100 MHz
2G Bands: GSM 1800 / 900 MHz
GPRS:Available
EDGE:Available
2G Bands: GSM 1800 / 900 MHz
GPRS:Available
EDGE:Available
Voice Calling:
Yes
Wi-Fi:Wireless lan technology
Wireless lan technologyWi-Fi 802.11, b/g/n
Wi-Fi Features:
Mobile Hotspot
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.Yes
USB Connectivity:
USB 2.0, microUSB 2.0
Multimedia Xelectron W007 Plus
Loudspeaker:
Yes
Audio Jack:
3.5 mm
Special Features Xelectron W007 Plus
Other Sensors:
Accelerometer
Comments, Questions and Answers about Xelectron W007 Plus
Ask a question about Xelectron W007 Plus
The company vivo presented the smartphone X Fold5, focusing not on cameras or design, but on durability and reliability. According to the manufacturer, this is the world's first foldable device with IP59+ water and dust resistance, which can withstand not only immersion to a depth of up to three meters, but also high-pressure hot water. At the same time, the device remains functional at temperatures as low as -20 ?C.
Fairphone announced the sixth generation of its smartphone, emphasizing repairability and modularity. The new model is 9% lighter and more compact than the previous model, with a larger battery that can be easily replaced at home.
A new insider report dedicated to the Google Pixel 10 smartphone includes almost complete hardware specifications of the future novelty. Judging by the fresh set of data, the device will be better than its predecessor in most of the main indicators.