Mobiles     Laptops     Tablets     Computers     Hardware  Components       Electronics

Wink - specifications phones

  Mobiles >> Wink



Wink City

Wink CityOS: Android 4.4.2
Resolution: 360x640
Screen Size: 5
Processor: MediaTek MT6582, Quad Core 1.3GHz
Dimensions: 144 x 74 x 8.5 mm
Battery capacity: Li-Ion 2000 mAh
arrWink City
arrSecret codes for Wink City

Wink City SE

Wink City SEOS: Android 5.1
Resolution: 640x360
Screen Size: 5
Processor: MediaTek MT6580A, Quad Core, 1.3GHz
Battery capacity: Li-Ion 2000 mAh
arrWink City SE
arrSecret codes for Wink City SE

Wink Glory

Wink GloryOS: Android 4.4.3
Resolution: 320x533
Screen Size: 4
Processor: MediaTek MT6572M, Dual Core 1GHz
Dimensions: 72 x 144 x 8 mm
Battery capacity: Li-Ion 1900 mAh
arrWink Glory
arrSecret codes for Wink Glory

Wink Glory SE

Wink Glory SEOS: Android 6.0
Resolution: 320x569
Screen Size: 5
Dimensions: 72 x 144 x 8 mm
Battery capacity: Li-Ion 1800 mAh
arrWink Glory SE
arrSecret codes for Wink Glory SE

Wink Share

Wink ShareOS: Android 5.1
Resolution: 570x320
Screen Size: 4.5
Processor: MediaTek MT6580M, Quad Core, 1.3GHz
Dimensions: 67 x 136 x 9.5 mm
Battery capacity: Li-Ion 1800 mAh
arrWink Share
arrSecret codes for Wink Share

Wink Uno

Wink UnoOS: Android 4.4.2
Resolution: 320x533
Screen Size: 4
Processor: Dual Core 1GHz
Dimensions: 64 x 125 x 10 mm
Battery capacity: Li-Ion 1400 mAh
arrWink Uno
arrSecret codes for Wink Uno

Wink World

Wink WorldOS: Android 4.4.2
Resolution: 320x533
Screen Size: 4
Processor: MediaTek MT6582, 1.3GHz
Dimensions: 124 x 64 x 10.9 mm
Battery capacity: Li-Ion 1400 mAh
arrWink World
arrSecret codes for Wink World

Wink Share Se

Wink Share SeOS: Android 6.0 Marshmallow
Display: LCD IPS Color (16M), 480x854 px (4.5") 218ppi
RAM: 1 GB
Built-in storage: 8 GB
arrWink Share Se
arrSecret codes for Wink Share Se





news
 Samsung Galaxy Z Fold7 will be the thinnest and lightest clamshell on the market

Samsung has shared new details about the upcoming Galaxy Z Fold7 foldable smartphone. The company has released a teaser hinting at the record-breaking small body thickness of the flagship device.



news
 Honor Magic 8 specs declassified ahead of the announcement

Honor is preparing to release a flagship series of smartphones Magic 8, which, according to insiders, will appear on the Chinese market at the end of the third quarter of this year. The new products will presumably run on the not yet announced chipset Snapdragon 8 Elite 2, the presentation of which is just scheduled for the end of September. Other technical details have also become known.



news
 Vivo Y400 Pro with Sony camera declassified before the presentation

Vivo has not yet announced a ?youth? smartphone Y400 Pro, but the Internet has already appeared on the unofficial list of characteristics of the future novelty. If you believe the insider report, the manufacturer will emphasize the design and photo capabilities of the device.