vivo Y200e specs.
Mobiles >> Vivo >> vivo Y200e| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
Basic Spec vivo Y200e
Smart Phone OS:
An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android 14, Funtouch 14
Chipset:Is a set of chips in the smartphone that control the CPU.
Is a set of chips in the smartphone that control the CPU.Qualcomm Snapdragon 4 Gen 2 (4 nm)
CPU:Central processing unit
Central processing unitOcta-core (2x2.2 GHz Cortex-A78 & 6x1.95 GHz Cortex-A55)
GPU:Graphics Processing Unit
Graphics Processing UnitAdreno 613
Display vivo Y200e
Type:
AMOLED, 120Hz, 1800 nits (peak)
Screen Size:This diagonal display size is usually measured in inches.
This diagonal display size is usually measured in inches.6.67 inches, 107.4 cm2 (~86.8% screen-to-body ratio)
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels1080 x 2400 pixels, 20:9 ratio (~395 ppi density)
Storage vivo Y200e
Card slot:
microSDXC
Internal:
128GB 6GB RAM, 128GB 8GB RAMRandom Access Memory
Random Access MemoryMain Camera vivo Y200e
Dual:
50 MP, f/1.8, (wide), PDAF
2 MP, f/2.4, (depth)
2 MP, f/2.4, (depth)
Features:
LED flash, panorama, HDR
Video:
1080p@30fps
Selfie camera vivo Y200e
Single camera:
16 MP, f/2.0, (wide)
Video:
1080p@30fps
Sound vivo Y200e
Loudspeaker:
Yes, with stereo speakers
3.5mm jack:
No
Network connectivity vivo Y200e
Technology:
GSM / HSPAHigh Speed Packet Access / LTE / 5G
High Speed Packet Access / LTE / 5G2G:Second generation cellular network
Second generation cellular networkGSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2
3G:Third generation cellular network
Third generation cellular networkHSDPAHigh-Speed Downlink Packet Access 850 / 900 / 2100
High-Speed Downlink Packet Access 850 / 900 / 2100 4G:Fourth generation cellular network
Fourth generation cellular network1, 3, 5, 8, 28, 38, 40, 41
5G:
1, 3, 5, 8, 28, 40, 77, 78 SA/NSA
Speed:
HSPA, LTE-A, 5G
WLAN:Wireless Local Area Network
Wireless Local Area NetworkWi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.5.0, A2DP, LE
Positioning:
GPS, GLONASSGLObal NAvigation Satellite System, GALILEOEuropean Global Navigation Satellite System, BDS, QZSSQuasi-Zenith Satellite System
GLObal NAvigation Satellite System, GALILEOEuropean Global Navigation Satellite System, BDS, QZSSQuasi-Zenith Satellite SystemNFC:Near field communication
Near field communicationNo
Radio:
No
USB:Universal Serial Bus
Universal Serial BusUSB Type-C 2.0, OTG
Phone features vivo Y200e
Sensors:
Fingerprint, accelerometer, gyro, proximity, compass, flicker
Battery vivo Y200e
Type:
Li-Ion 5000 mAh, non-removable
Charging:
44W wired, 1-32% in 15 min (advertised)
Size vivo Y200e
Dimensions:
163.2 x 75.8 x 7.8 mm (6.43 x 2.98 x 0.31 in)
Weight:
185.5 g or 191 g (6.56 oz)
Build:
Glass front, plastic or silicone polymer (eco leather) back
SIM:
Hybrid Dual SIM (Nano-SIM, dual stand-by)
Comments, Questions and Answers about vivo Y200e
Ask a question about vivo Y200e
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.