Vertex C311 specs.
Mobiles >> VERTEX >> Vertex C311| Specifications | Reviews | Secret codes |
Basic Spec VERTEX C311
CPU:
Central processing unit
Central processing unitMediaTek MT6261
Built-in memory:
32 Mb
Memory card slot:
yes, volume of up to 32 GB
Multi SIM mode:
alternate
SIM-card amount:
2
Design VERTEX C311
Case type:
classic
Case material:
plastic
Height:
123 mm
Width:
58.5 mm
Thickness:
12.5 mm
Weight:
93 grams
Display VERTEX C311
Screen Size:This diagonal display size is usually measured in inches.
This diagonal display size is usually measured in inches.2"
Screen type:
colored
Screen Size:This diagonal display size is usually measured in inches.
This diagonal display size is usually measured in inches.176x220
Number of pixels per inch (PPI):
141
Camera VERTEX C311
Resolution of the main camera:
0.30 MP
The number of main cameras:
1
Flash:
absent
Connectivity VERTEX C311
Standard:
GSM 900, 1800, 1900
Interfaces:
Bluetooth 2.0
Multimedia VERTEX C311
Audio:
MP3, FM-radio
Headphone jack:
3.5 mm
Other functions VERTEX C311
Flashlight:
yes
Speakerphone:
yes
Battery VERTEX C311
Battery capacity:
1400 mA⋅h
Battery type:
Li-Ion
Connector type for charging:
micro-USB
Standby time:
400 hours
Talk time:
7 hours
Comments, Questions and Answers about Vertex C311
Ask a question about Vertex C311
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.