Spice Popkorn specs.
Mobiles >> Spice >> Spice Popkorn| Specifications | Reviews | Secret codes |
General Spice Popkorn
Alternate names:
M-9000
Release date:
March 2011
Form factor:
Bar
Dimensions (mm):
119.20 x 50.30 x 17.40
Weight (g):
123.00
Battery capacity (mAh):
1200
Removable battery:
Yes
Colours:
Black, Silver
SAR value:
NA
Display Spice Popkorn
Screen size (inches):
2.36
Screen Resolution:
Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels240x320pixels
Pixels per inch (PPI):
169
Hardware Spice Popkorn
Internal storage:
87MB
Expandable storage:
Yes
Expandable storage type:
microSD
Expandable storage up to (GB):
16
Camera Spice Popkorn
Rear camera:
3.15-megapixel
Flash:
No
Front camera:
No
Software Spice Popkorn
Smart Phone OS:An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Proprietary
Skin:
NA
Connectivity Spice Popkorn
Wi-Fi:Wireless lan technology
Wireless lan technologyNo
GPS:Global Positioning System
Global Positioning SystemNo
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.Yes, v 2.10
NFC:Near field communication
Near field communicationNo
Infrared:
No
Wi-Fi Direct:
No
MHL Out:
No
HDMI:
No
Headphones:
No
FM:
Yes
Number of SIMs:
2
SIM 1:
SIM Type:
Regular
GSM/ CDMA:
GSM
3G:Third generation cellular network
Third generation cellular networkNo
4G/ LTE:
No
SIM 2:
SIM Type:
Regular
GSM/ CDMA:
GSM
3G:Third generation cellular network
Third generation cellular networkNo
4G/ LTE:
No
Sensors Spice Popkorn
Compass:
No
Proximity sensor:
No
Accelerometer:
No
Ambient light sensor:
No
Gyroscope:
No
Barometer:
No
Temperature sensor:
No
Comments, Questions and Answers about Spice Popkorn
Ask a question about Spice Popkorn
HMD in partnership with Lava will launch TV-enabled phones. The devices will be unveiled at the Visual and Entertainment Summit (WAVES) 2025 event from May 1-4.
Panasonic announced a new model of wireless headphones RB-F10. They are made in the form factor of open wireless earbuds with behind-the-ear fastening, which allows you to listen to music and at the same time not shut out from the world around you. The headphones are also suitable for sports.
Ahead of its imminent premiere, the Sony Xperia 1 VII smartphone with model number Sony XQ-FS54 was spotted in the Geekbench database. The device card revealed information about the key features of the future novelty and its performance.