Mobiles     Laptops     Tablets     Computers     Hardware  Components   Electronics   News

Sony Xperia 4 specs.

  Mobiles >> Sony >> Sony Xperia 4

Specifications | Reviews | Secret codes
Unlock phone | Root phone
Backup | Flash Firmware | Screenshot


Sony Xperia 4




Basic Spec Sony Xperia 4
Smart Phone OS:?An operating system (OS) is software that interacts between a user and a smartphone.
Android v9.0 (Pie)
CPU:?Central processing unit
Octa core (2.2 GHz, Dual core, Kryo 360 1.7 GHz, Hexa Core, Kryo 360)
Chipset:?Is a set of chips in the smartphone that control the CPU.
Qualcomm Snapdragon 710
Architecture:
64 bit
GPU:?Graphics Processing Unit
Adreno 616
RAM:?Random Access Memory
4 GB
Display Sony Xperia 4
Screen Size:?This diagonal display size is usually measured in inches.
5.7 inches (14.48 cm)
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
1080 x 2520 pixels
Aspect Ratio:
21:9
Display Type:
IPS LCD
Display dots per inch:
481 ppi
Touch Screen:
Yes, Capacitive Touchscreen, Multi-touch
Bezel-less display:
Yes
Screen Protection:
Corning Gorilla Glass
Storage Sony Xperia 4
Internal Memory:
64 GB
Expandable Memory:
Yes, Up to 512 GB
Communication Sony Xperia 4
SIM 1:
4G Bands: TD-LTE 2300(band 40)
FD-LTE 1800(band 3) 3G Bands: UMTS 1900 / 2100 / 850 / 900 MHz 2G Bands: GSM 1800 / 1900 / 850 / 900 MHz
GPRS: Available EDGE: Available
SIM 2:
4G Bands: TD-LTE 2300(band 40)
FD-LTE 1800(band 3) 3G Bands: UMTS 1900 / 2100 / 850 / 900 MHz 2G Bands: GSM 1800 / 1900 / 850 / 900 MHz
GPRS: Available EDGE: Available
SIM Slot(s):
Dual SIM, GSM GSM
Network Support:
5G, 4G, 3G, 2G
Bluetooth:?Bluetooth is used to exchange data between nearby mobile devices.
Yes, v5.0
GPS:?Global Positioning System
Yes with A-GPS?Assisted Global Positioning System, GLONASS?GLObal NAvigation Satellite System
NFC:?Near field communication
Yes
USB Connectivity:
Mass storage device, USB charging
VoLTE:
Yes
Wi-Fi:?Wireless lan technology
Yes, Wi-Fi 4 (802.11 b/g/n)
Wi-Fi Features:
Mobile Hotspot
Main camera Sony Xperia 4
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
13 MP, Primary Camera
5 MP
Image Resolution:
4128 x 3096 Pixels
Camera Setup:
Dual
Flash:
Yes, LED Flash
Camera Features:
Digital Zoom
Auto Flash
Face detection
Touch to focus
Autofocus:
Yes
Settings:
Exposure compensation, ISO control
Shooting Modes:
Continuous Shooting
High Dynamic Range mode (HDR)
Selfie camera Sony Xperia 4
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
8 MP, Primary Camera
Camera Setup:
Single
Multimedia Sony Xperia 4
Audio Jack:
3.5 mm
Loudspeaker:
Yes
Other features Sony Xperia 4
Fingerprint Sensor:
Yes
Other Sensors:
Light sensor, Proximity sensor, Accelerometer, Compass, Gyroscope
Design Sony Xperia 4
Width:
65 mm
Height:
149 mm
Thickness:
8.3 mm
Battery Sony Xperia 4
Type:
Li-ion
Battery capacity:
2800 mAh
Battery removable:
No
Quick Charging:
Yes, Fast
USB Type-C:
Yes




Comments, Questions and Answers about Sony Xperia 4




Ask a question about Sony Xperia 4
 
  
      4+10= *


Sony Xperia 4
news
 REDMI K90 Max Key Specs Confirmed by Benchmark

Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.



news
 New affordable realme smartphone features a 144Hz display

The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.



news
 The Honor 600 Lite features a body crafted using ?rocket? technology

A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.

The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.