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Shenzhen Alps M8

Shenzhen Alps M8OS: Android 4.2.2
Resolution: 320x569
Screen Size: 5
Processor: MediaTek MTK6572W, Dual Core 1.3GHz, ARM Cortex A7, ARM MALI-400
Dimensions: 153 x 77.8 x 8.9 mm
Battery capacity: Li-Ion 1400 mAh
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Shenzhen B4513

Shenzhen B4513OS: Android 4.2.2
Resolution: 854x480
Screen Size: 4.5
Processor: MediaTek MT6572
Battery capacity: Li-Ion
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Shenzhen Disko MI4 D84

Shenzhen Disko MI4 D84OS: Android 4.4.2
Resolution: 320x533
Screen Size: 4
Processor: Spreadtrum SC7715, 1.2 GHz
Dimensions: 124.5 x 63.5 x 9 mm
Battery capacity: Li-Ion 2800 mAh
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Shenzhen E706

Shenzhen E706OS: Android 4.4.2
Resolution: 800x432, 800x480
Screen Size: 3
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Shenzhen I402

Shenzhen I402OS: Android 4.4.2
Resolution: 320x533
Screen Size: 4
Processor: MediaTek MTK6515M
Battery capacity: Li-Ion 1500 mAh
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Shenzhen I57A

Shenzhen I57AOS: Android 4.0.4
Resolution: 800x480
Screen Size: 5.3
Processor: MediaTek MTK6577, Dual Core 1GHz, ARM Cortex A9
Dimensions: 148 x 79 x 10.5 mm
Battery capacity: Li-Ion 2500 mAh
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Shenzhen Q5501

Shenzhen Q5501OS: Android 6.0
Resolution: 640x360
Screen Size: 5.5
Processor: MediaTek MT6737, Quad Core 1.2GHz
Dimensions: 153.3 x 78.2 x 9.3 mm
Battery capacity: Li-Ion 2100 mAh
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Shenzhen S230A

Shenzhen S230AOS: Android 4.2.2
Resolution: 800x480
Screen Size: 3.97
Processor: MTK6572, Dual Core 1.3GHz, ARM Cortex A7
Dimensions: 125 x 64 x 8 mm
Battery capacity: Li-Ion 1200 mAh
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Shenzhen S66

Shenzhen S66OS: Android 4.4.3
Resolution: 1024x768
Screen Size: 3.5
Processor: Spreadtrum SC6820
Dimensions: 117 x 62.5 x 9.8 mm
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Shenzhen Z32

Shenzhen Z32OS: Android 4.1
Resolution: 455x320, 1416x996
Screen Size: 3.5
Processor: Spectrum SC6820
Dimensions: 127 x 66 x 9 mm
Battery capacity: Li-Ion 1000 mAh
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 Samsung Galaxy Z Fold7 will be the thinnest and lightest clamshell on the market

Samsung has shared new details about the upcoming Galaxy Z Fold7 foldable smartphone. The company has released a teaser hinting at the record-breaking small body thickness of the flagship device.



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 Honor Magic 8 specs declassified ahead of the announcement

Honor is preparing to release a flagship series of smartphones Magic 8, which, according to insiders, will appear on the Chinese market at the end of the third quarter of this year. The new products will presumably run on the not yet announced chipset Snapdragon 8 Elite 2, the presentation of which is just scheduled for the end of September. Other technical details have also become known.



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 Vivo Y400 Pro with Sony camera declassified before the presentation

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