PiPO W1S specs.
Mobiles >> PiPO >> PiPO W1S| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
General characteristics PiPO W1S
Chip:
Intel Atom x5-Z8300
Process technology:
14 nm
CPU:
Central processing unit
Central processing unitIntel Cherry Trail
CPU bits:
64 bit
Instruction set:
IA-32 (x86), IA-64 (x64)
Level 1 cache memory (L1):
24 KB + 32 KB
Level 2 cache memory (L2):
2048 KB
CPU cores:
4
CPU frequency:
1840 MHz
GPU:Graphics Processing Unit
Graphics Processing UnitIntel HD Graphics
GPU frequency:
500 MHz
RAM capacity:
2 GB
4 GB
4 GB
RAM type:
LPDDR3L-RS
RAM channels:
Single channel
RAM frequency:
1600 MHz
Operating system (OS):
Microsoft Windows 10
Features:
Optional SIM (A device not intended for phone calls but with an option for SIM card slot)
Display PiPO W1S
Type/technology:
IPS
Screen Size:This diagonal display size is usually measured in inches.
This diagonal display size is usually measured in inches.10.1 in
Width:
8.56 in
Height:
5.35 in
Aspect ratio:
1.6
16:10
16:10
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels1920 x 1200 pixels
Pixel density:
224 ppi
Color depth:
24 bit
16777216 colors
16777216 colors
Display area:
66.14 %
Other features:
Capacitive
Multi-touch
Multi-touch
Sensors PiPO W1S
Sensors:
Accelerometer
Primary camera PiPO W1S
Sensor type:
CMOS (complementary metal-oxide semiconductor)
Image resolution:
2560 x 1920 pixels
4.92 MP
4.92 MP
Features:
Digital zoom
Self-timer
Self-timer
Secondary camera PiPO W1S
Image resolution:
1600 x 1200 pixels
1.92 MP
1.92 MP
Memory PiPO W1S
Storage:
32 GB
64 GB , eMMC
64 GB , eMMC
Types:
microSD
microSDHC
microSDHC
Connectivity PiPO W1S
Wi-Fi:Wireless lan technology
Wireless lan technology802.11b (IEEE 802.11b-1999)
802.11g (IEEE 802.11g-2003)
802.11n (IEEE 802.11n-2009)
802.11g (IEEE 802.11g-2003)
802.11n (IEEE 802.11n-2009)
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.4.0
Features:
A2DP (Advanced Audio Distribution Profile)
Connector type:
Micro USB
USB:Universal Serial Bus
Universal Serial Bus2.0
Features:
Charging
Mass storage
On-The-Go
Mass storage
On-The-Go
Connectivity:
Computer sync
OTA sync
Tethering
OTA sync
Tethering
HDMI:
Mini HDMI (Type C)
Browser:
HTML
HTML5
CSS 3
HTML5
CSS 3
Multimedia PiPO W1S
Speaker:
Loudspeaker
Stereo speakers
Stereo speakers
Radio:
No
Headphone jack:
Yes
Audio file formats/codecs:
AAC (Advanced Audio Coding)
FLAC (Free Lossless Audio Codec, .flac)
MIDI
MP3 (MPEG-2 Audio Layer II, .mp3)
OGG (.ogg, .ogv, .oga, .ogx, .spx, .opus)
WMA (Windows Media Audio, .wma)
WAV (Waveform Audio File Format, .wav, .wave)
FLAC (Free Lossless Audio Codec, .flac)
MIDI
MP3 (MPEG-2 Audio Layer II, .mp3)
OGG (.ogg, .ogv, .oga, .ogx, .spx, .opus)
WMA (Windows Media Audio, .wma)
WAV (Waveform Audio File Format, .wav, .wave)
Video file formats/codecs:
3GPP (3rd Generation Partnership Project, .3gp)
Flash Video (.flv, .f4v, .f4p, .f4a, .f4b)
MKV (Matroska Multimedia Container, .mkv .mk3d .mka .mks)
QuickTime (.mov, .qt)
MP4 (MPEG-4 Part 14, .mp4, .m4a, .m4p, .m4b, .m4r, .m4v)
WMV (Windows Media Video, .wmv)
Xvid
Flash Video (.flv, .f4v, .f4p, .f4a, .f4b)
MKV (Matroska Multimedia Container, .mkv .mk3d .mka .mks)
QuickTime (.mov, .qt)
MP4 (MPEG-4 Part 14, .mp4, .m4a, .m4p, .m4b, .m4r, .m4v)
WMV (Windows Media Video, .wmv)
Xvid
Design PiPO W1S
Width:
258 mm
Height:
173.9 mm
Thickness:
12 mm
Weight:
590 g
Volume:
538.39 cm³
Colors:
Black
Body materials:
Metal
Plastic
Plastic
Battery PiPO W1S
Capacity:
6700 mAh
Type:
Li-Polymer
Charger output power:
5 V
Features:
Non-removable
Additional features PiPO W1S
Additional features:
Docking connector
Comments, Questions and Answers about PiPO W1S
Ask a question about PiPO W1S
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.