Mobiles     Laptops     Tablets     Computers     Hardware  Components   Electronics   News

PiPO M9Pro specs.

  Mobiles >> PiPO >> PiPO M9Pro

Specifications | Reviews | Secret codes
Unlock phone | Root phone
Backup | Flash Firmware | Screenshot



General characteristics PiPO M9Pro
Chip:
Rockchip RK3188
Process technology:
28 nm
CPU:?Central processing unit
ARM Cortex-A9
CPU bits:
32 bit
Instruction set:
ARMv7-A
Level 1 cache memory (L1):
32 KB + 32 KB
Level 2 cache memory (L2):
512 KB
CPU cores:
4
CPU frequency:
1600 MHz
GPU:?Graphics Processing Unit
ARM Mali-400 MP4
GPU cores:
4
RAM capacity:
2 GB
RAM type:
LPDDR3
Operating system (OS):
Android 4.2.2 Jelly Bean
SIM card type:
Mini-SIM (2FF - second form factor, since late 1990s, 25.00 x 15.00 x 0.76 mm)
Number of SIM cards:
1
Features:
Optional SIM (A device not intended for phone calls but with an option for SIM card slot)
Display PiPO M9Pro
Type/technology:
IPS
Screen Size:?This diagonal display size is usually measured in inches.
10.1 in
Width:
8.56 in
Height:
5.35 in
Aspect ratio:
1.6
16:10
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
1920 x 1200 pixels
Pixel density:
224 ppi
Color depth:
24 bit
16777216 colors
Display area:
69.05 %
Other features:
Capacitive
Multi-touch
Sensors PiPO M9Pro
Sensors:
Light
Accelerometer
Gyroscope
Gravity
Primary camera PiPO M9Pro
Flash type:
LED
Image resolution:
2592 x 1944 pixels
5.04 MP
Video resolution:
1920 x 1080 pixels
2.07 MP
Features:
Autofocus
Secondary camera PiPO M9Pro
Image resolution:
1600 x 1200 pixels
1.92 MP
Memory PiPO M9Pro
Storage:
32 GB
Types:
microSD
microSDHC
microSDXC
Connectivity PiPO M9Pro
GSM:
GSM 850 MHz
GSM 900 MHz
GSM 1800 MHz
GSM 1900 MHz
W-CDMA:
W-CDMA 900 MHz
W-CDMA 2100 MHz
Tracking/Positioning:
GPS
Wi-Fi:?Wireless lan technology
802.11b (IEEE 802.11b-1999)
802.11g (IEEE 802.11g-2003)
802.11n (IEEE 802.11n-2009)
Wi-Fi Direct
Bluetooth:?Bluetooth is used to exchange data between nearby mobile devices.
4.0
Features:
A2DP (Advanced Audio Distribution Profile)
Connector type:
Micro USB
USB:?Universal Serial Bus
2.0
Features:
Charging
Host
Mass storage
On-The-Go
Connectivity:
Computer sync
OTA sync
Tethering
HDMI:
Mini HDMI (Type C)
Browser:
HTML
HTML5
CSS 3
Multimedia PiPO M9Pro
Speaker:
Loudspeaker
Stereo speakers
Headphone jack:
Yes
Audio file formats/codecs:
AAC (Advanced Audio Coding)
FLAC (Free Lossless Audio Codec, .flac)
MP3 (MPEG-2 Audio Layer II, .mp3)
OGG (.ogg, .ogv, .oga, .ogx, .spx, .opus)
WMA (Windows Media Audio, .wma)
WAV (Waveform Audio File Format, .wav, .wave)
Video file formats/codecs:
AVI (Audio Video Interleaved, .avi)
Flash Video (.flv, .f4v, .f4p, .f4a, .f4b)
MKV (Matroska Multimedia Container, .mkv .mk3d .mka .mks)
QuickTime (.mov, .qt)
MP4 (MPEG-4 Part 14, .mp4, .m4a, .m4p, .m4b, .m4r, .m4v)
Design PiPO M9Pro
Width:
247 mm
Height:
174 mm
Thickness:
10.5 mm
Weight:
596 g
Volume:
451.27 cm³
Colors:
Black
White
Body materials:
Metal
Plastic
Battery PiPO M9Pro
Capacity:
7600 mAh
Type:
Li-Ion
Features:
Non-removable, Battery life - up to 8 h




Comments, Questions and Answers about PiPO M9Pro




Ask a question about PiPO M9Pro
 
  
      8+8= *


news
 REDMI K90 Max Key Specs Confirmed by Benchmark

Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.



news
 New affordable realme smartphone features a 144Hz display

The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.



news
 The Honor 600 Lite features a body crafted using ?rocket? technology

A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.

The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.