PiPO M8Pro specs.
Mobiles >> PiPO >> PiPO M8Pro| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
General characteristics PiPO M8Pro
Chip:
Rockchip RK3188
Process technology:
28 nm
CPU:
Central processing unit
Central processing unitARM Cortex-A9
CPU bits:
32 bit
Instruction set:
ARMv7-A
Level 1 cache memory (L1):
32 KB + 32 KB
Level 2 cache memory (L2):
512 KB
CPU cores:
4
CPU frequency:
1600 MHz
GPU:Graphics Processing Unit
Graphics Processing UnitARM Mali-400 MP4
GPU cores:
4
RAM capacity:
2 GB
RAM type:
LPDDR3
Operating system (OS):
Android 4.1.1 Jelly Bean
Android 4.2.2 Jelly Bean
Android 4.2.2 Jelly Bean
Display PiPO M8Pro
Type/technology:
IPS
Screen Size:This diagonal display size is usually measured in inches.
This diagonal display size is usually measured in inches.9.4 in
Width:
7.97 in
Height:
4.98 in
Aspect ratio:
1.6
16:10
16:10
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels1280 x 800 pixels
Pixel density:
161 ppi
Color depth:
24 bit
16777216 colors
16777216 colors
Display area:
62.27 %
Other features:
Capacitive
Multi-touch, Viewing angle - 178°
Multi-touch, Viewing angle - 178°
Sensors PiPO M8Pro
Sensors:
Light
Accelerometer
Compass
Gyroscope
Accelerometer
Compass
Gyroscope
Primary camera PiPO M8Pro
Sensor type:
CMOS (complementary metal-oxide semiconductor)
Flash type:
LED
Image resolution:
2592 x 1944 pixels
5.04 MP
5.04 MP
Features:
Autofocus
Digital zoom
Touch focus
Face detection
Self-timer
Scene mode
Digital zoom
Touch focus
Face detection
Self-timer
Scene mode
Secondary camera PiPO M8Pro
Image resolution:
1600 x 1200 pixels
1.92 MP
1.92 MP
Memory PiPO M8Pro
Storage:
16 GB
Types:
microSD
microSDHC
microSDHC
Connectivity PiPO M8Pro
Wi-Fi:Wireless lan technology
Wireless lan technology802.11b (IEEE 802.11b-1999)
802.11g (IEEE 802.11g-2003)
802.11n (IEEE 802.11n-2009)
802.11g (IEEE 802.11g-2003)
802.11n (IEEE 802.11n-2009)
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.4.0
Features:
A2DP (Advanced Audio Distribution Profile)
Connector type:
Micro USB
USB:Universal Serial Bus
Universal Serial Bus2.0
Features:
Charging
Mass storage
On-The-Go
Mass storage
On-The-Go
Connectivity:
Computer sync
OTA sync
Tethering
OTA sync
Tethering
HDMI:
Mini HDMI (Type C)
Browser:
HTML
HTML5
CSS 3
HTML5
CSS 3
Multimedia PiPO M8Pro
Speaker:
Loudspeaker
Stereo speakers
Stereo speakers
Radio:
No
Headphone jack:
Yes
Audio file formats/codecs:
AAC (Advanced Audio Coding)
eAAC+ / aacPlus v2 / HE-AAC v2
MIDI
MP3 (MPEG-2 Audio Layer II, .mp3)
WMA (Windows Media Audio, .wma)
WAV (Waveform Audio File Format, .wav, .wave)
eAAC+ / aacPlus v2 / HE-AAC v2
MIDI
MP3 (MPEG-2 Audio Layer II, .mp3)
WMA (Windows Media Audio, .wma)
WAV (Waveform Audio File Format, .wav, .wave)
Video file formats/codecs:
3GPP (3rd Generation Partnership Project, .3gp)
AVI (Audio Video Interleaved, .avi)
Flash Video (.flv, .f4v, .f4p, .f4a, .f4b)
H.263
H.264 / MPEG-4 Part 10 / AVC video
MKV (Matroska Multimedia Container, .mkv .mk3d .mka .mks)
MP4 (MPEG-4 Part 14, .mp4, .m4a, .m4p, .m4b, .m4r, .m4v)
Xvid
AVI (Audio Video Interleaved, .avi)
Flash Video (.flv, .f4v, .f4p, .f4a, .f4b)
H.263
H.264 / MPEG-4 Part 10 / AVC video
MKV (Matroska Multimedia Container, .mkv .mk3d .mka .mks)
MP4 (MPEG-4 Part 14, .mp4, .m4a, .m4p, .m4b, .m4r, .m4v)
Xvid
Design PiPO M8Pro
Width:
240 mm
Height:
172 mm
Thickness:
10.8 mm
Weight:
522 g
Volume:
445.82 cm³
Colors:
Black
Silver
Silver
Body materials:
Aluminium alloy
Plastic
Plastic
Battery PiPO M8Pro
Capacity:
6500 mAh
Type:
Li-Polymer
Features:
Non-removable, Battery life - up to 7 h
Additional features PiPO M8Pro
Additional features:
3G dongle
Comments, Questions and Answers about PiPO M8Pro
Ask a question about PiPO M8Pro
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.