Phone directory PiPO
Mobiles >> PiPOPiPO Smart S2 |
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 | Resolution: 768 x 1024 pixels Screen Size: 8 inches Processor: Dual core, 1.6 GHz, Cortex A9 System chip: Rockchip RK3066 System memory: 1 GB Internal Memory: 16 GB Dimensions: 204 (H) x 164 (W) x 13 (T) mm Battery capacity: 5000 |
 PiPO Smart S2Secret codes for PiPO Smart S2 |
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PiPO P106 |
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 | Resolution: 800 x 1280 pixels Screen Size: 10.1 inches Processor: Dual core, 1.6 GHz, Cortex A9 System chip: Rockchip RK3066 System memory: 1 GB Battery capacity: 3800 mAh |
| PiPO P106Secret codes for PiPO P106 |
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PiPO Q108 |
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 | Resolution: 800 x 1280 pixels Screen Size: 10.1 inches Processor: Quad core, 1.6 GHz, Cortex A9 System chip: Rockchip RK3188 System memory: 2 GB Battery capacity: 8000 mAh |
| PiPO Q108Secret codes for PiPO Q108 |
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PiPO M8HD |
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 | Resolution: 1200 x 1920 pixels Screen Size: 10.1 inches Processor: Quad core, 1.8 GHz, ARM Cortex A9 System chip: Rockchip RK3188 System memory: 2 GB Internal Memory: 16 GB Dimensions: 240 (H) x 172 (W) x 10.5 (T) mm Battery capa |
| PiPO M8HDSecret codes for PiPO M8HD |
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PiPO T3 |
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 | Resolution: 600 x 1024 pixels Screen Size: 7 inches Processor: Quad core, 1.3 GHz, ARM Cortex A7 System chip: MediaTek System memory: 1 GB Internal Memory: 8 GB Dimensions: 194 (H) x 120 (W) x 11 (T) mm Battery capacity: 4000 mAh |
| PiPO T3Secret codes for PiPO T3 |
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Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.