Mobiles     Laptops     Tablets     Computers     Hardware  Components   Electronics   News

Oppo F31 Pro plus specs.

  Mobiles >> Oppo >> Oppo F31 Pro plus

Specifications | Reviews | Secret codes
Unlock phone | Root phone
Backup | Flash Firmware | Screenshot


Oppo F31 Pro plus




Basic Spec Oppo F31 Pro plus
Smart Phone OS:?An operating system (OS) is software that interacts between a user and a smartphone.
Android 15, ColorOS 15
Chipset:?Is a set of chips in the smartphone that control the CPU.
Qualcomm SM7550-AB Snapdragon 7 Gen 3 (4 nm)
CPU:?Central processing unit
Octa-core (1x2.63 GHz Cortex-A715 & 3x2.4 GHz Cortex-A715 & 4x1.8 GHz Cortex-A510)
GPU:?Graphics Processing Unit
Adreno 720
Display Oppo F31 Pro plus
Type:
AMOLED, 1B colors, 120Hz, 1600 nits (HBM)
Screen Size:?This diagonal display size is usually measured in inches.
6.8 inches, 112.8 cm2 (~89.1% screen-to-body ratio)
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
1280 x 2800 pixels, 19.5:9 ratio (~453 ppi density)
Protection:
AGC DT-Star D+
Storage Oppo F31 Pro plus
Card slot:
No
Internal:
256GB 8GB RAM, 256GB 12GB RAM?Random Access Memory
Main Camera Oppo F31 Pro plus
Dual:
50 MP, f/1.8, (wide), PDAF, OIS
2 MP, f/2.4, (depth)
Features:
Color spectrum sensor, LED flash, HDR, panorama
Video:
4K@30fps, 1080p@30/60/120fps, gyro-EIS, OIS
Selfie camera Oppo F31 Pro plus
Single camera:
32 MP, f/2.4, (wide)
Features:
Panorama
Video:
1080p@30fps, gyro-EIS
Sound Oppo F31 Pro plus
Loudspeaker:
Yes, with stereo speakers
3.5mm jack:
No
Network connectivity Oppo F31 Pro plus
Technology:
GSM / HSPA?High Speed Packet Access / LTE / 5G
2G:?Second generation cellular network
GSM 850 / 900 / 1800 / 1900
3G:?Third generation cellular network
HSDPA?High-Speed Downlink Packet Access 900 / 2100
4G:?Fourth generation cellular network
1, 3, 5, 8, 19, 28, 38, 40, 41, 42, 48
5G:
1, 3, 5, 8, 28, 38, 40, 41, 77, 78 SA/NSA
Speed:
HSPA, LTE, 5G
Connectivity Oppo F31 Pro plus
WLAN:?Wireless Local Area Network
Wi-Fi 802.11 a/b/g/n/ac/6, dual-band
Bluetooth:?Bluetooth is used to exchange data between nearby mobile devices.
5.2, A2DP, LE, aptX HD
Positioning:
GPS (L1+L5), BDS (B1I+B1c+B2a), GALILEO?European Global Navigation Satellite System (E1+E5a), QZSS?Quasi-Zenith Satellite System (L1+L5), NavIC (L5), GLONASS?GLObal NAvigation Satellite System
NFC:?Near field communication
No
Infrared port:
Yes
Radio:
No
USB:?Universal Serial Bus
USB Type-C 2.0, OTG
Regulatory Oppo F31 Pro plus
Colors:
Festival Pink, Himalayan White, Gemstone Blue
Models:
CPH2757
SAR:
1.16 W/kg (head)     0.99 W/kg (body)    
Price:
About 320 EUR
Phone features Oppo F31 Pro plus
Sensors:
Fingerprint, accelerometer, gyro, proximity, compass
Battery Oppo F31 Pro plus
Type:
Si/C Li-Ion 7000 mAh
Charging:
80W wired, 13.5W PD, 44W UFCS, 33W PPS, 42% in 20 min
10W reverse wired
Size Oppo F31 Pro plus
Dimensions:
163.1 x 77.6 x 7.7 mm or 7.9 mm
Weight:
195 or 204 g (6.88 oz)
SIM:
Nano-SIM + Nano-SIM




Comments, Questions and Answers about Oppo F31 Pro plus




Ask a question about Oppo F31 Pro plus
 
  
      10+3= *


Oppo F31 Pro plus
news
 REDMI K90 Max Key Specs Confirmed by Benchmark

Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.



news
 New affordable realme smartphone features a 144Hz display

The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.



news
 The Honor 600 Lite features a body crafted using ?rocket? technology

A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.

The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.