MyZentab - specifications phones
Mobiles >> MyZentabMyZentab 708B |
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 | Resolution: 800 x 400 pixels Screen Size: 7 inches Processor: 1.2 GHz System chip: Boxchip A13 System memory: 512 MB Internal Memory: 4 GB Dimensions: 193 (H) x 121 (W) x 8.50 (T) mm Battery capacity: 2350 mAh |
 MyZentab 708BSecret codes for MyZentab 708B |
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MyZentab 708BH |
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 | Resolution: 800 x 400 pixels Screen Size: 7 inches Processor: 1.2 GHz System chip: Boxchip A10 System memory: 512 MB Internal Memory: 8 GB Dimensions: 195 (H) x 122 (W) x 11.70 (T) mm Battery capacity: 3200 mAh |
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MyZentab 970B |
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 | Resolution: 1024 x 768 pixels Screen Size: 9.7 inches Processor: 1.2 GHz System chip: Boxchip A10 System memory: 1 GB Internal Memory: 8 GB Dimensions: 190 (H) x 243 (W) x 11.40 (T) mm Battery capacity: 6000 mAh |
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MyZentab 773BH |
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 | Resolution: 1024 x 600 pixels Screen Size: 7 inches Processor: 1.2 GHz System chip: Boxchip A10 System memory: 1 GB Internal Memory: 16 GB Dimensions: 194 (H) x 123 (W) x 10 (T) mm Battery capacity: 3200 mAh |
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MyZentab 773B |
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 | Resolution: 800 x 400 pixels Screen Size: 7 inches Processor: 1.2 GHz System chip: Boxchip A10 System memory: 512 MB Internal Memory: 8 GB Dimensions: 194.2 (H) x 121.4 (W) x 11.45 (T) mm Battery capacity: 3200 mAh |
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MyZentab Tabfone |
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 | Resolution: 800 x 480 pixels Screen Size: 5 inches System memory: 512 MB Internal Memory: 4 GB Dimensions: 146 (H) x 82 (W) x 11.30 (T) mm Battery capacity: 2300 mAh |
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MyZentab Tabook |
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 | Resolution: 1280 x 800 pixels Screen Size: 10.1 inches Processor: Dual core, 1.5 GHz, Cortext A9 System chip: Rockchip System memory: 1 GB Internal Memory: 8 GB Dimensions: 266 (H) x 175 (W) x 9.70 (T) mm Battery capacity: 6200 m |
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Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.