myPhone Fun 3 specs.
Mobiles >> MyPhone >> myPhone Fun 3| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
Basic spec MyPhone Fun 3
GSM frequencies:
900 1800
Standard UMTS:
900 2100
Standard LTE:
no
Type:
Touch
Dimensions (W x H x D):
135.00 x 67.00 x 9.45 mm
Main display:
Color / TFT
16M colors
480 x 854 px (4.50") 218 ppi
16M colors
480 x 854 px (4.50") 218 ppi
Display protection:
no
Stand-by (max.):
2G: 264 h (11.0 days)
Standard battery:
Li-Ion 1800 mAh
Quick battery charging:
no
Internal memory:
8 GB
RAM memory:
1 GB
Memory cards:
yes
Smart Phone OS:
An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android 4.4 KitKat
Processor:
MediaTek MT6582M
Processor clock:
1.30 GHz
Number of cores:
4
GPU:Graphics Processing Unit
Graphics Processing UnitARM Mali-400 MP2 @416 MHz
Touchscreen:
yes
DualSIM:
yes
SIM cards standard:
miniSIM, miniSIM
DualSIM mode:
-
Hybrid DualSIM:
no
Announced:
-
Digital camera MyPhone Fun 3
Camera location:
Back
Photo matrix:
5 Mpx
Flash:
yes, LED
Video resolution:
1920x1080
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels2592x1944 px
Digital zoom:
yes
Dual-colour LED flash:
no
Video formats:
MPEG4, H.263, H.264 - 30 fps
Addidtional:
AF
Secondary camera MyPhone Fun 3
Camera location:
Front
Photo matrix:
2 Mpx
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels1600x1200 px
Dual-colour LED flash:
no
Sensors MyPhone Fun 3
Accelerometer:
yes
Proximity:
yes
Light:
yes
Magnetometer:
no
Gyroscope:
no
Gravity:
no
Hall-effect:
no
Fingerprint scanner:
no
Data transfer MyPhone Fun 3
xHTML:
yes
WAP:
yes, v2.0
HSDPA:High-Speed Downlink Packet Access
High-Speed Downlink Packet Accessyes, 21.00 Mbit/s
HSUPA:High Speed Uplink Packet Access
High Speed Uplink Packet Accessyes, 5.76 Mbit/s
HSPA:
yes
HSPA+:High Speed Packet Access
High Speed Packet Accessyes
GPRS:General Packet Radio Service
General Packet Radio Serviceyes
EDGE:
yes
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.yes, v4.0+EDR
A2DP Profile:
yes
Wi-Fi:Wireless lan technology
Wireless lan technologyyes, v802.11 b/g/n
WiFi frequencies:
2.4 GHz
Hotspot WiFi:
yes
USB:Universal Serial Bus
Universal Serial Busyes, v2.0
GPS module:
yes
A-GPS:Assisted Global Positioning System
Assisted Global Positioning Systemyes
NFC:Near field communication
Near field communicationno
Communication and messaging MyPhone Fun 3
Call waiting:
yes
Conferency:
yes
Call forwarding:
yes
Instant Messenger:
yes
SMS:
yes
MMS:
yes
Dictionary:
yes, XT9
e-mail client:
yes
e-mail protocols:
POP3, IMAP4, SMTP
RSS Reader:
yes
Multimedia MyPhone Fun 3
Radio:
yes
MP3:
yes
Audio Jack:
3.5 mm
HD Voice:
no
Sound formats:
AAC, AAC+, eAAC+, AMR, WAV
Polyphony:
yes
Games:
yes
Java:
yes, Dalvik
DVB-H television:
no
Business features MyPhone Fun 3
Watch:
yes
Stopwatch:
yes
Alarm:
yes
Calculator:
yes
Currency converter:
no
Organizer:
yes
Calendar:
yes
Flight mode:
yes
Data and fax:
yes
Other features MyPhone Fun 3
Screensaver:
yes
Themes:
yes
Interchangeable covers:
no
Voice dial:
yes
Loudspeaker:
yes
Recorder:
yes
Vibra:
yes
Comments, Questions and Answers about myPhone Fun 3
Ask a question about myPhone Fun 3
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.