Mintt - specifications phones
Mobiles >> MinttMintt CoolMintt DUO3 |
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 | OS: Android 9.0 (Pie) Display Resolution: 720 x 1520 pixels, 19:9 ratio (~286 ppi density) System chip: Mediatek MT6739 (28 nm) Dimensions: 148 x 72.5 x 9.6 mm |
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Mintt UltraMintt A5 |
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 | OS: Android 10 Display Resolution: 720 x 1560 pixels, 19.5:9 ratio (~292 ppi density) System chip: Mediatek MT6762D Helio A25 (12 nm) Dimensions: 154 x 74 x 9 mm |
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Mintt UltraMintt X3 |
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 | OS: Android 10.0 Display Resolution: 720 x 1520 pixels, 19.5:9 ratio (~294 ppi density) System chip: Mediatek MT6762V/WC Helio P22 (12 nm) Dimensions: 155.4 x 71.8 x 8.1 mm |
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Mintt UltraMintt X5 |
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 | OS: Android 10 Display Resolution: 720 x 1600 pixels, 20:9 ratio (~272 ppi density) System chip: Mediatek MT6762V/WDA Helio A25 (12 nm) Dimensions: 164.6 x 76.5 x 8.8 mm |
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Mintt UltraMintt Y3 |
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 | OS: Android 9.0 (Pie) Display Resolution: 1080 x 2340 pixels, 19:9 ratio (~407 ppi density) System chip: Mediatek MT6771 Helio P60 (12 nm) Dimensions: 157 x 75.8 x 8.75 mm |
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Mintt UltraMintt Y5 |
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 | OS: Android 10 Display Resolution: 1080 x 2340 pixels, 19.5:9 ratio (~407 ppi density) System chip: Mediatek MT6771 Helio P60 (12 nm) Dimensions: 157 x 75.1 x 8.65 mm |
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Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.