Micromax In 1 specs.
Mobiles >> Micromax >> Micromax In 1| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
Hardware and OS Micromax In 1
Smart Phone OS:
An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android 10
Processor:
Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)
Chipset:Is a set of chips in the smartphone that control the CPU.
Is a set of chips in the smartphone that control the CPU.Mediatek Helio G80 (12 nm)
GPU:Graphics Processing Unit
Graphics Processing UnitMali-G52 MC2
Internal memory:
64GB 4GB RAM, 128GB 6GB RAMRandom Access Memory
Random Access MemoryExternal memory:
microSDXC (dedicated slot)
Design Micromax In 1
Type:
IPS LCD, 440 nits (peak)
Size:
6.67 inches, 107.4 cm2
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels1080 x 2400 pixels, 20:9 ratio
SIM:
Dual SIM (Nano-SIM, dual stand-by)
Dimensions:
165.2 x 77 x 9 mm (6.50 x 3.03 x 0.35 in)
Weight:
195 g (6.88 oz)
Colors:
Blue, Purple
Connectivity Micromax In 1
2G:Second generation cellular network
Second generation cellular networkGSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2
3G:Third generation cellular network
Third generation cellular networkHSDPAHigh-Speed Downlink Packet Access 850 / 900 / 2100
High-Speed Downlink Packet Access 850 / 900 / 21004G:Fourth generation cellular network
Fourth generation cellular network1, 3, 5, 8, 40, 41
WLAN:Wireless Local Area Network
Wireless Local Area NetworkWi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.5.0, A2DP, LE
GPS:Global Positioning System
Global Positioning SystemYes, with A-GPSAssisted Global Positioning System, GLONASSGLObal NAvigation Satellite System, GALILEOEuropean Global Navigation Satellite System, BDS
Assisted Global Positioning System, GLONASSGLObal NAvigation Satellite System, GALILEOEuropean Global Navigation Satellite System, BDSNFC:Near field communication
Near field communicationNo
USB:Universal Serial Bus
Universal Serial BusUSB Type-C 2.0, USB On-The-Go
Speed:
HSPAHigh Speed Packet Access 42.2/11.5 Mbps, LTE-A (CA)
High Speed Packet Access 42.2/11.5 Mbps, LTE-A (CA)Technology:
GSM / HSPAHigh Speed Packet Access / LTE
High Speed Packet Access / LTEMain Camera Micromax In 1
Camera:
48 MP, f/1.8, 26mm (wide), 1/2.0", 0.8Вµm, PDAF
2 MP, f/2.4, (macro)
2 MP, f/2.4, (depth)
2 MP, f/2.4, (macro)
2 MP, f/2.4, (depth)
Features:
LED flash, HDR
Video:
1080p@30fps
Selfie camera Micromax In 1
Camera:
8 MP, f/2.0, (wide), 1/4.0", 1.12Вµm
Video:
1080p@30fps
Multimedia Micromax In 1
Radio:
FM radio
3.5 mm Jack:
Yes
Loudspeaker:
Yes
Features Micromax In 1
Sensors:
Fingerprint (rear-mounted), accelerometer, gyro, proximity, compass
Battery Micromax In 1
Type:
Li-Po 5000 mAh, non-removable
Charging:
Fast charging 18W
Reverse charging
Reverse charging
Comments, Questions and Answers about Micromax In 1
Ask a question about Micromax In 1
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.