Meizu Pro 6 Mini specs.
Mobiles >> Meizu >> Meizu Pro 6 Mini| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
Design Meizu Pro 6 Mini
Colors:
Golden, Gray, Silver
Weight:
145g, (Unofficial)
Network Meizu Pro 6 Mini
2G:
Second generation cellular network
Second generation cellular networkGSM 850, GSM 900, GSM 1800, GSM 1900
4G:Fourth generation cellular network
Fourth generation cellular networkLTE 2100, LTE 800, LTE 1800, LTE 2600, LTE 900, LTE 1900, LTE 2300, LTE 2500
SIM:
Hybrid Dual Sim
Display Meizu Pro 6 Mini
Type:
Super AMOLED capacitive touchscreen, (Force Touch Display)
Display Colors:
16M Colors
Size:
4.7 Inch
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels1080 x 1920 pixels
Pixel Density:
~469 ppi Pixels Density
Protection:
Corning Gorilla Glass, 4
Camera Meizu Pro 6 Mini
Primary:
Yes
Flash:
Yes
Video Recording:
With 1080p
Secondary:
Yes
Camera Flash:
No
Camera Features:
Autofocus, Gesture Shot, Voice Capture, Burst Mode, HDR, Smile detection, Face Detection, Self timer, Face Recognition, Touch focus, PDAF Sensor, Slow Motion Video,OIS Sensor
Media Meizu Pro 6 Mini
Audio Playback:
WAV, AAC , OGG, MKA, APE, FLAC, MIDI, WMA, M4A, MP3, AMR, AAC, eAAC
Ring Tones:
Vibration, MP3 ringtones, WAV
FM Radio:
Yes
3.5mm jack:
Yes
Software Meizu Pro 6 Mini
Smart Phone OS:An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android 6.0 (Marshmallow), (Flyme UI)
Hardware Meizu Pro 6 Mini
Chipset:Is a set of chips in the smartphone that control the CPU.
Is a set of chips in the smartphone that control the CPU.MediaTek, Helio X25 MT6797T
CPU:Central processing unit
Central processing unit2.5 GHz, And 2.0 GHz Deca Core Processor, (10-Cores)
GPU:Graphics Processing Unit
Graphics Processing UnitMali T880, MP4
RAM:Random Access Memory
Random Access Memory4 GB
Internal Storage:
32 GB, 64 GB, 128 GB
Card Slot:
MicroSD, (Uses Sim 2 slot for microSD card) Upto 128 GB
Sensors:
Proximity Sensor, Accelerometer, Compass, Ambient Light, G-Sensor, Gyro, Fingerprint, Hall Effect Sensor
Connectivity Meizu Pro 6 Mini
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.Bluetooth 4.2, With BLE
Wi-Fi:Wireless lan technology
Wireless lan technologyWi-Fi 802.11 a/b/g/n/ac, Wi-Fi Direct, Dual Band
GPS:Global Positioning System
Global Positioning Systemwith A-GPSAssisted Global Positioning System support, GLONASSGLObal NAvigation Satellite System
Assisted Global Positioning System support, GLONASSGLObal NAvigation Satellite SystemUSB:Universal Serial Bus
Universal Serial BusYes
NFC:Near field communication
Near field communicationYes, (NFC 3.0)
Data Meizu Pro 6 Mini
Speed:
HSPAHigh Speed Packet Access plus, LTE
High Speed Packet Access plus, LTEWeb Browser:
Android Browser
Battery Meizu Pro 6 Mini
Battery Type:
Li-Po 2800 mAh, (Built-in Battery)
Wireless Charging:
No
Quick Charge:
Yes
Talk Time:
10 Hrs, (Unofficial)
Music Play:
Up to 26 Hrs
Features:
280 Hrs, (Unofficial)
Comments, Questions and Answers about Meizu Pro 6 Mini
Ask a question about Meizu Pro 6 Mini
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.