LeTV X507 Le 1s specs.
Mobiles >> LeTV >> LeTV X507 Le 1s| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
Basic Spec Letv X507 Le 1s
Smart Phone OS:
An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android 5.0 Lollipop
CPU:Central processing unit
Central processing unitCortex-A53
CPU frequency:
2200.0 MHz (8-core)
Chipset:Is a set of chips in the smartphone that control the CPU.
Is a set of chips in the smartphone that control the CPU.MediaTek MT6795 Helio X1
GPU:Graphics Processing Unit
Graphics Processing UnitPowerVR G6200
RAM Memory:
3 GB
Display Letv X507 Le 1s
Display:
LCD IPS Color (16M), 1080x1920 px (5.5") 401ppi
Touch screen:
yes
Storage Letv X507 Le 1s
Built-in memory:
32 GB
Camera Letv X507 Le 1s
Camera:
13.0 MPx
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels4416x2944 px
Flash:
LED
Autofocus:
yes
Optical zoom:
no
Digital zoom:
yes
Second camera:
5.04 Mpx
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels2592x1944 px
Communication Letv X507 Le 1s
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.4.1
EDGE:
yes
GPRS:General Packet Radio Service
General Packet Radio Serviceyes
GPS:Global Positioning System
Global Positioning Systemyes
A-GPS:Assisted Global Positioning System
Assisted Global Positioning Systemyes
GLONASSGLObal NAvigation Satellite System:
GLObal NAvigation Satellite System:yes
LTE:
LTE-FDD: 1800, 1900, 2100, 2300, 2600
GSM:
850 900 1800 1900
HSDPA:High-Speed Downlink Packet Access
High-Speed Downlink Packet Access850 900 1900 2100 HSPA
HSUPA speed:
5,76 Mb/s
HSDPAHigh-Speed Downlink Packet Access speed:
High-Speed Downlink Packet Access speed:42 Mb/s
USB:Universal Serial Bus
Universal Serial BusType C
WAP:
2.0
Wi-Fi:Wireless lan technology
Wireless lan technology802.11 b/g/n
Multimedia Letv X507 Le 1s
Audio formats:
MP3, WAV, eAAC , FLAC
Audio out:
Jack 3,5 mm
Games:
yes
MP3 player:
yes
MP3 ringtones:
yes
Polyphony:
yes
Radio:
yes
RDS:Radio Data System
Radio Data Systemyes
RSS:
yes
Vibra:
yes
Dictaphone:
yes
Loudspeaker:
yes
Voice dialing:
yes
Sensors Letv X507 Le 1s
Accelerometer:
yes
Light sensor:
yes
Proximity sensor:
yes
Digital compass:
yes
Design Letv X507 Le 1s
Dual SIM:
yes
SIM card size:
Micro Sim, Nano Sim
Dimensions:
151.1 x 74.2 x 7.6 mm, vol. 85.2 cm³
Weight:
169 g
Phone resistant:
no
Battery Letv X507 Le 1s
Capacity:
Li-Ion 3000 mAh
Non-removable battery:
yes
Comments, Questions and Answers about LeTV X507 Le 1s
Ask a question about LeTV X507 Le 1s
OPPO has revealed the premiere date for the international versions of the Reno13 and 13 Pro smartphones. At the same time, the company has published promotional teasers showing the colors in which the new products will arrive on the global market.
Blackview has released a new rugged smartphone Blackview BV8200. In addition to a rugged body, the device has a 120Hz screen, an additional display on the back, an 8800mAh battery, a bright flashlight and an AI camera.
Xiaomi has unveiled its first 2025 smartphone, the Redmi Turbo 4. It is notable for its 6550 mAh solid state battery and the latest MediaTek Dimensity 8400 Ultra processor with flagship configuration. The features of the device don't end there.