Hisense EG980 specs.
Mobiles >> Hisense >> Hisense EG980| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
General characteristics Hisense EG980
Type:
Mobile
Battery:
Li-Ion 2500 mAh
CPU:
Central processing unit
Central processing unitMediaTek MT6589T, Quad Core 1.5GHz
Smart Phone OS:An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android 4.2.1
Dimensions:
155.23 x 76.7 x 8.6 mm
Formfactor:
Bar
Keyboard:
Screen
Sidekeys:
Volume, Power
Softkeys:
3
Display Hisense EG980
Color:
Yes
Other:
Capacitive Touchscreen, Multitouch
Pixel aspect ratio:
2.00
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels640x360
Display PPI:
267
Screen Size:This diagonal display size is usually measured in inches.
This diagonal display size is usually measured in inches.5.5
Type:
IPS
Audio:
MP3, WAV, AAC, MIDI, AMR
Camera:
8MP, 3264x2448
Other:
Autofocus, LED Flash, Geo-Tagging
Secondcamera:
2MP, 1600x1200
Videocapture:
YES
Videoplayback:
MP4
Other functions Hisense EG980
Connectors:
3.5mm Audio, MicroUSB 2.0, USB OTG 1.3
Network:
GSM900, GSM1800, GSM1900, CDMA EVDO800, EDGE, GPRSGeneral Packet Radio Service, EVDOEvolution-Data Optimized Rev A, Bluetooth, WIFI, 802.11b, 802.11g, 802.11n, GPS, TD-SCDMA, TD-HSDPAHigh-Speed Downlink Packet Access, A-GPS, TD-SCDMA1900, TD-SCDMA2000
General Packet Radio Service, EVDOEvolution-Data Optimized Rev A, Bluetooth, WIFI, 802.11b, 802.11g, 802.11n, GPS, TD-SCDMA, TD-HSDPAHigh-Speed Downlink Packet Access, A-GPS, TD-SCDMA1900, TD-SCDMA2000Features:
Dual SIM, Dual Standby, Loudspeaker, Microphone, Proximity Sensor, Gravity Sensor, Ambient Light Sensor, Magnetic Field Sensor, FM Radio, Quick GPS
Memory Internal:
8GB, 1GB RAMRandom Access Memory
Random Access MemoryMemory Slot:
MicroSD, 32GB
Comments, Questions and Answers about Hisense EG980
Ask a question about Hisense EG980
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.