Mobiles     Laptops     Tablets     Computers     Hardware  Components   Electronics   News

Hisense EG970 specs.

  Mobiles >> Hisense >> Hisense EG970

Specifications | Reviews | Secret codes
Unlock phone | Root phone
Backup | Flash Firmware | Screenshot


Hisense EG970




General characteristics Hisense EG970
Aliases:
Hisense MIRA EG970
Type:
Mobile
Battery:
Li-Ion 2000 mAh
CPU:?Central processing unit
Qualcomm Snapdragon 200 MSM8625Q, ARM Cortex A5, 1.2GHz, ARMv7, Adreno 203
Smart Phone OS:?An operating system (OS) is software that interacts between a user and a smartphone.
Android 4.1.2
Dimensions:
142 x 72.7 x 8.7 mm
Formfactor:
Bar
Keyboard:
Screen
Sidekeys:
Power, Volume
Softkeys:
3
Weight:
145 g
Display Hisense EG970
Color:
Yes
Colors:
16M
Other:
Capacitive Multi Touchscreen
Pixel aspect ratio:
1.50
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
540x960
Display PPI:
220
Screen Size:?This diagonal display size is usually measured in inches.
5
Type:
IPS TFT
Audio:
Polyphonic, MP3, WAV, AMR, AWB
Camera:
8MP, 3264 x2448
Other:
CMOS Sensor, Autofocus, 1x Optical Zoom, Macro Mode, LED Flash, Camcorder, HDR, Panorama
Secondcamera:
0.3MP, 640x480
Videocapture:
Yes, 1080p, 30fps
Videoplayback:
MPEG4, 3GP, 3G2, MP4
Other functions Hisense EG970
Connectors:
3.5mm Audio, USB 2.0, USB OTG, MicroUSB
Network:
CDMA800, CDMA2000 1xRTT, CDMA2000 1xEV-DO Rev A, GSM900, GSM1800, GSM1900, GPRS?General Packet Radio Service, EDGE, WiFi, 802.11b, 802.11g, 802.11n, GPS, DLNA, Bluetooth 2.0, A2DP
Features:
Microphone, Loudspeaker, Call Alert, Vibrating Alert, Speakerphone, FM Radio with RDS, Assisted GPS, QuickGPS, Digital Compass, Active Noise Cancellation, Proximity Sensor, Light Sensor, Dual SIM Dual Standby, Flashlight, Tethering & portable hotspot, Call Recording, Acceleration Sensor, Distance sensor
Memory Internal:
4GB ROM, 1GB RAM?Random Access Memory
Memory Slot:
microSD, microSDHC, Transflash, 32GB




Comments, Questions and Answers about Hisense EG970




Ask a question about Hisense EG970
 
  
      4+6= *


Hisense EG970
news
 REDMI K90 Max Key Specs Confirmed by Benchmark

Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.



news
 New affordable realme smartphone features a 144Hz display

The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.



news
 The Honor 600 Lite features a body crafted using ?rocket? technology

A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.

The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.