Hisense EG970 specs.
Mobiles >> Hisense >> Hisense EG970| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
General characteristics Hisense EG970
Aliases:
Hisense MIRA EG970
Type:
Mobile
Battery:
Li-Ion 2000 mAh
CPU:
Central processing unit
Central processing unitQualcomm Snapdragon 200 MSM8625Q, ARM Cortex A5, 1.2GHz, ARMv7, Adreno 203
Smart Phone OS:An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android 4.1.2
Dimensions:
142 x 72.7 x 8.7 mm
Formfactor:
Bar
Keyboard:
Screen
Sidekeys:
Power, Volume
Softkeys:
3
Weight:
145 g
Display Hisense EG970
Color:
Yes
Colors:
16M
Other:
Capacitive Multi Touchscreen
Pixel aspect ratio:
1.50
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels540x960
Display PPI:
220
Screen Size:This diagonal display size is usually measured in inches.
This diagonal display size is usually measured in inches.5
Type:
IPS TFT
Audio:
Polyphonic, MP3, WAV, AMR, AWB
Camera:
8MP, 3264 x2448
Other:
CMOS Sensor, Autofocus, 1x Optical Zoom, Macro Mode, LED Flash, Camcorder, HDR, Panorama
Secondcamera:
0.3MP, 640x480
Videocapture:
Yes, 1080p, 30fps
Videoplayback:
MPEG4, 3GP, 3G2, MP4
Other functions Hisense EG970
Connectors:
3.5mm Audio, USB 2.0, USB OTG, MicroUSB
Network:
CDMA800, CDMA2000 1xRTT, CDMA2000 1xEV-DO Rev A, GSM900, GSM1800, GSM1900, GPRSGeneral Packet Radio Service, EDGE, WiFi, 802.11b, 802.11g, 802.11n, GPS, DLNA, Bluetooth 2.0, A2DP
General Packet Radio Service, EDGE, WiFi, 802.11b, 802.11g, 802.11n, GPS, DLNA, Bluetooth 2.0, A2DPFeatures:
Microphone, Loudspeaker, Call Alert, Vibrating Alert, Speakerphone, FM Radio with RDS, Assisted GPS, QuickGPS, Digital Compass, Active Noise Cancellation, Proximity Sensor, Light Sensor, Dual SIM Dual Standby, Flashlight, Tethering & portable hotspot, Call Recording, Acceleration Sensor, Distance sensor
Memory Internal:
4GB ROM, 1GB RAMRandom Access Memory
Random Access MemoryMemory Slot:
microSD, microSDHC, Transflash, 32GB
Comments, Questions and Answers about Hisense EG970
Ask a question about Hisense EG970
The company vivo presented the smartphone X Fold5, focusing not on cameras or design, but on durability and reliability. According to the manufacturer, this is the world's first foldable device with IP59+ water and dust resistance, which can withstand not only immersion to a depth of up to three meters, but also high-pressure hot water. At the same time, the device remains functional at temperatures as low as -20 ?C.
Fairphone announced the sixth generation of its smartphone, emphasizing repairability and modularity. The new model is 9% lighter and more compact than the previous model, with a larger battery that can be easily replaced at home.
A new insider report dedicated to the Google Pixel 10 smartphone includes almost complete hardware specifications of the future novelty. Judging by the fresh set of data, the device will be better than its predecessor in most of the main indicators.