Mobiles     Laptops     Tablets     Computers     Hardware  Components       Electronics

Hi-Tech Kick 565 specs.

  Mobiles >> Hi-Tech >> Hi-Tech Kick 565

Specifications | Reviews | Secret codes


Hi-Tech Kick 565




General Information Hi-Tech Kick 565
SIM Slot(s):
Dual SIM, GSM+GSM
Network:
4G: Not Available, 3G: Not Available, 2G: Available
Fingerprint Sensor:
No
Quick Charging:
No
Body Hi-Tech Kick 565
Colours:
Black
Display Hi-Tech Kick 565
Screen Size:?This diagonal display size is usually measured in inches.
2.8 inches
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
240 x 320 pixels
Pixel Density:
143 ppi
Display Type:
TFT
Screen Protection:
No
Memory Hi-Tech Kick 565
Expandable Memory:
Up to 8 GB
USB OTG Support:
No
Camera Hi-Tech Kick 565
Screen Resolution:?Screen resolution refers to the size of the image received on the screen in pixels
0.3 MP
Autofocus:
No
Optical Image Stabilisation:
No
Flash:
Yes
Image Resolution:
640 x 480 Pixels
Camera Features:
Digital Zoom
Battery Hi-Tech Kick 565
Battery capacity:
2800 mAh
Type:
Li-ion
Not User Replaceable:
No
Talktime:
Up to 3 Hours(2G)
Standby Time:
Up to 150 Hours(2G)
Connectivity Hi-Tech Kick 565
Network Support:
2G
SIM 1:
2G Bands: GSM 1800 / 900 MHz
GPRS:Available
SIM 2:
2G Bands: GSM 1800 / 900 MHz
Bluetooth:?Bluetooth is used to exchange data between nearby mobile devices.
Yes
NFC:?Near field communication
No
HDMI:
No
Multimedia Hi-Tech Kick 565
FM Radio:
Yes
Loudspeaker:
Yes
Audio Jack:
3.5 mm
Ring Tone:
Music ringtones, Polyphonic ringtones, Vibration
Music:
Music Formats: MP3
Special Features Hi-Tech Kick 565
Fingerprint Sensor:
No
Games:
Yes
Browser:
WAP
Phone Book:
Limited
Other Facilities:
Calculator, Stopwatch, World clock, Calendar, Alarm




Comments, Questions and Answers about Hi-Tech Kick 565




Ask a question about Hi-Tech Kick 565
 
  
      2+3= *


Hi-Tech Kick 565
news
 Samsung Galaxy Z Fold7 will be the thinnest and lightest clamshell on the market

Samsung has shared new details about the upcoming Galaxy Z Fold7 foldable smartphone. The company has released a teaser hinting at the record-breaking small body thickness of the flagship device.



news
 Honor Magic 8 specs declassified ahead of the announcement

Honor is preparing to release a flagship series of smartphones Magic 8, which, according to insiders, will appear on the Chinese market at the end of the third quarter of this year. The new products will presumably run on the not yet announced chipset Snapdragon 8 Elite 2, the presentation of which is just scheduled for the end of September. Other technical details have also become known.



news
 Vivo Y400 Pro with Sony camera declassified before the presentation

Vivo has not yet announced a ?youth? smartphone Y400 Pro, but the Internet has already appeared on the unofficial list of characteristics of the future novelty. If you believe the insider report, the manufacturer will emphasize the design and photo capabilities of the device.