HTC Wildfire E3 specs.
Mobiles >> HTC >> HTC Wildfire E3| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
Hardware and OS HTC Wildfire E3
Smart Phone OS:
An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android 10
Processor:
Octa-core 1.8 GHz Cortex-A53
Chipset:Is a set of chips in the smartphone that control the CPU.
Is a set of chips in the smartphone that control the CPU.Mediatek MT6762 Helio P22 (12 nm)
GPU:Graphics Processing Unit
Graphics Processing UnitPowerVR GE8320
Internal memory:
64GB 4GB RAM, 128GB 4GB RAMRandom Access Memory
Random Access MemoryExternal memory:
microSDXC (uses shared SIM slot)
Design HTC Wildfire E3
Type:
IPS LCD
Size:
6.52 inches, 104.4 cm2
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels720 x 1560 pixels, 19.5:9 ratio
Body build:
Glass front, plastic back, plastic frame
SIM:
Hybrid Dual SIM (Nano-SIM, dual stand-by)
Dimensions:
165.7 x 76.6 x 9 mm (6.52 x 3.02 x 0.35 in)
Weight:
186 g (6.56 oz)
Colors:
Blue, Black
Connectivity HTC Wildfire E3
2G:Second generation cellular network
Second generation cellular networkGSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2
3G:Third generation cellular network
Third generation cellular networkHSDPAHigh-Speed Downlink Packet Access 900 / 2100
High-Speed Downlink Packet Access 900 / 21004G:Fourth generation cellular network
Fourth generation cellular network1, 3, 5, 7, 8, 20, 38, 40
WLAN:Wireless Local Area Network
Wireless Local Area NetworkWi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.4.2, A2DP, LE
GPS:Global Positioning System
Global Positioning SystemYes, with A-GPSAssisted Global Positioning System, GLONASSGLObal NAvigation Satellite System, GALILEOEuropean Global Navigation Satellite System, BDS
Assisted Global Positioning System, GLONASSGLObal NAvigation Satellite System, GALILEOEuropean Global Navigation Satellite System, BDSNFC:Near field communication
Near field communicationNo
USB:Universal Serial Bus
Universal Serial BusUSB Type-C 2.0, USB On-The-Go
Speed:
HSPAHigh Speed Packet Access 42.2/5.76 Mbps, LTE Cat4 150/75 Mbps
High Speed Packet Access 42.2/5.76 Mbps, LTE Cat4 150/75 MbpsTechnology:
GSM / HSPAHigh Speed Packet Access / LTE
High Speed Packet Access / LTEMain Camera HTC Wildfire E3
Camera:
13 MP, f/2.0, (wide), PDAF
8 MP, f/2.2, (ultrawide)
2 MP, f/2.4, (macro)
2 MP, f/2.4, (depth)
8 MP, f/2.2, (ultrawide)
2 MP, f/2.4, (macro)
2 MP, f/2.4, (depth)
Features:
LED flash, HDR, panorama
Video:
1080p@30fps
Selfie camera HTC Wildfire E3
Camera:
13 MP, f/2.0, (wide)
Video:
720p@30fps
Multimedia HTC Wildfire E3
Radio:
FM radio
3.5 mm Jack:
Yes
Loudspeaker:
Yes
Features HTC Wildfire E3
Sensors:
Fingerprint (rear-mounted), accelerometer, proximity, compass
Battery HTC Wildfire E3
Type:
Li-Po 4000 mAh, non-removable
Charging:
Charging 10W
Comments, Questions and Answers about HTC Wildfire E3
Ask a question about HTC Wildfire E3
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.