Fujitsu-Siemens Rugged N560 specs.
Mobiles >> Fujitsu-Siemens >> Fujitsu-Siemens Rugged N560| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
General characteristics Fujitsu-Siemens Rugged N560
CPU:
Central processing unit
Central processing unit624MHz
RAM:Random Access Memory
Random Access Memory64MB
Internal Memory:
128MB
External Memory:
SD
Speaker:
Mono
Battery Capacity:
1200mAh
Battery Type:
Usability Fujitsu-Siemens Rugged N560
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels480x640px
Screen Size:This diagonal display size is usually measured in inches.
This diagonal display size is usually measured in inches.Display Diagonal:
Display Type:
65k TFT
Secondary Display Resolution:
Input:
Navigation Joystick / Button
Capacitive Touchscreen
Capacitive Touchscreen
Talk Time:
3 hours
Standby Time:
8 days, 8 hours
Smart Phone OS:An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Windows Mobile 5.0 PPC
Java:
MIDP 2.0
Vibration:
Yes
Ringtone:
Polyphonic
Communication Fujitsu-Siemens Rugged N560
USB:Universal Serial Bus
Universal Serial Busv1.1
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.v1.2
Positioning System:
Integrated GPS
Audio Output:
3.5mm Jack
Radio:
Infrared:
Infrared
Network Fujitsu-Siemens Rugged N560
Network Compatibility:
GSM 1800, 1900, 850, 900
SIM Cards:
EDGE:
Class 10
Design Fujitsu-Siemens Rugged N560
Dimension:
125x74x26mm (4.92x2.91x1.02")
Weight:
240gr (8.47oz)
Form Factor:
Candy Bar
Material:
Drop Resistant
Dust Resistant
Water Resistant
Dust Resistant
Water Resistant
Comments, Questions and Answers about Fujitsu-Siemens Rugged N560
Ask a question about Fujitsu-Siemens Rugged N560
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.