Coolpad Dazen 11 specs.
Mobiles >> Coolpad >> Coolpad Dazen 11| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
General Information Coolpad Dazen 11
Sim Type:
GSM+GSM
Dual Sim:
Yes
Device Type:
Smartphone
Design Coolpad Dazen 11
Dimensions:
67 x 134 x 10 mm
Weight:
135 g
Display Coolpad Dazen 11
Type:
Color IPS screen
Touchscreen:
Yes
Size:
5 inches, 540 x 960 pixels
PPI:
~ 220 PPI
Memory Coolpad Dazen 11
RAM:
Random Access Memory
Random Access Memory2 GB
Internal memory:
8 GB inbuilt
Card Slot:
Yes, upto 32 GB
Connectivity Coolpad Dazen 11
3G:Third generation cellular network
Third generation cellular networkYes
4G:Fourth generation cellular network
Fourth generation cellular networkYes
Wi-Fi:Wireless lan technology
Wireless lan technologyYes
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.Yes
Extra Coolpad Dazen 11
GPS:Global Positioning System
Global Positioning SystemYes
Sensors:
Accelerometer
3.5mm Headphone Jack:
Yes
Camera Coolpad Dazen 11
Camera:
Yes, 13 MP
Flash:
LED
Front Camera:
Yes, 5 MP
Technical Coolpad Dazen 11
Smart Phone OS:An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android, v4.4.2 (KitKat)
Processor:
1.6 GHz, Quad Core, MediaTek MTK6582M processor Processor
GPU:Graphics Processing Unit
Graphics Processing UnitAdreno 306 GPU
Multimedia Coolpad Dazen 11
FM Radio:
Yes
Battery Coolpad Dazen 11
Size:
2500 mAH, Li-ion Battery
Comments, Questions and Answers about Coolpad Dazen 11
Ask a question about Coolpad Dazen 11
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.