Coolpad Dashen F1 Plus specs.
Mobiles >> Coolpad >> Coolpad Dashen F1 Plus| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
Basic Spec Coolpad Dashen F1 Plus
Smart Phone OS:
An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android 4.3 Jelly Bean
CPU:Central processing unit
Central processing unitARM Cortex-A7
CPU frequency:
1200.0 MHz (4-core)
Chipset:Is a set of chips in the smartphone that control the CPU.
Is a set of chips in the smartphone that control the CPU.Qualcomm Snapdragon 400 MSM8926
GPU:Graphics Processing Unit
Graphics Processing UnitQualcomm Adreno 305
RAM Memory:
2 GB
Display Coolpad Dashen F1 Plus
Display:
LCD IPS Color (16M), 720x1280 px (5.95") 245ppi
Touch screen:
yes
Protection:
Corning Gorilla Glass
Storage Coolpad Dashen F1 Plus
Built-in memory:
16 GB
Memory card:
MicroSDHC max. 64 GB
Camera Coolpad Dashen F1 Plus
Camera:
12.78 MPx
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels4128 x 3096 px
Flash:
LED
Autofocus:
yes
Diaphragm:
f/2.0
Optical zoom:
no
Digital zoom:
no
Second camera:
5.04 Mpx
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels2592 x 1944 px
Communication Coolpad Dashen F1 Plus
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.4.0
NFC:Near field communication
Near field communicationyes
EDGE:
yes
GPRS:General Packet Radio Service
General Packet Radio Serviceyes
GPS:Global Positioning System
Global Positioning Systemyes
A-GPS:Assisted Global Positioning System
Assisted Global Positioning Systemyes
LTE:
LTE-FDD: 1800, 2100, LTE-TDD: 1900, 2300, 2500, 2600
GSM:
850 900 1800 1900
HSDPA:High-Speed Downlink Packet Access
High-Speed Downlink Packet Access850 900 1900 2100 HSPA
HSUPA speed:
5,76 Mb/s
HSDPAHigh-Speed Downlink Packet Access speed:
High-Speed Downlink Packet Access speed:21 Mb/s
USB:Universal Serial Bus
Universal Serial Bus2.0
WAP:
2.0
Wi-Fi:Wireless lan technology
Wireless lan technology802.11 a/b/g/n
Multimedia Coolpad Dashen F1 Plus
Audio formats:
AAC, AAC , MP3, WAV, AMR
Audio out:
Jack 3,5 mm
MP3 player:
yes
MP3 ringtones:
yes
Polyphony:
yes
Radio:
yes
RDS:Radio Data System
Radio Data Systemyes
RSS:
yes
Vibra:
yes
Dictaphone:
yes
Loudspeaker:
yes
Voice dialing:
yes
Sensors Coolpad Dashen F1 Plus
Accelerometer:
yes
Light sensor:
yes
Proximity sensor:
yes
Design Coolpad Dashen F1 Plus
Dual SIM:
yes
SIM card size:
Micro Sim, Micro Sim
Dimensions:
163 x 82 x 7 mm, vol. 105.6 cm³
Weight:
169 g
Phone resistant:
no
Battery Coolpad Dashen F1 Plus
Capacity:
Li-Po 2800 mAh
Non-removable battery:
yes
Comments, Questions and Answers about Coolpad Dashen F1 Plus
Ask a question about Coolpad Dashen F1 Plus
The company vivo presented the smartphone X Fold5, focusing not on cameras or design, but on durability and reliability. According to the manufacturer, this is the world's first foldable device with IP59+ water and dust resistance, which can withstand not only immersion to a depth of up to three meters, but also high-pressure hot water. At the same time, the device remains functional at temperatures as low as -20 ?C.
Fairphone announced the sixth generation of its smartphone, emphasizing repairability and modularity. The new model is 9% lighter and more compact than the previous model, with a larger battery that can be easily replaced at home.
A new insider report dedicated to the Google Pixel 10 smartphone includes almost complete hardware specifications of the future novelty. Judging by the fresh set of data, the device will be better than its predecessor in most of the main indicators.