Bundy Mobile Sweet 55 Plus specs.
Mobiles >> Bundy >> Bundy Mobile Sweet 55 Plus| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
Basic Spec Bundy Mobile Sweet 55 Plus
Smart Phone OS:
An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android 7.0 Nougat
CPU:Central processing unit
Central processing unitCortex-A53
CPU frequency:
1300.0 MHz (4-core)
Chipset:Is a set of chips in the smartphone that control the CPU.
Is a set of chips in the smartphone that control the CPU.MTK6737
GPU:Graphics Processing Unit
Graphics Processing UnitArm Mali-T720
GPU frequency:
650.0 MHz (1-core)
RAM Memory:
1 GB
Display Bundy Mobile Sweet 55 Plus
Display:
LCD IPS Color (16M), 720x1280 px (5.0") 294ppi
Touch screen:
yes
Storage Bundy Mobile Sweet 55 Plus
Built-in memory:
8 GB
Memory card:
MicroSDHC max. 32 GB
Camera Bundy Mobile Sweet 55 Plus
Camera:
5.04 MPx
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels2592 x 1944 px
Flash:
LED
Autofocus:
yes
Optical zoom:
no
Digital zoom:
yes
Second camera:
5.04 Mpx
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels2592 x 1944 px
Communication Bundy Mobile Sweet 55 Plus
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.yes
EDGE:
yes
GPRS:General Packet Radio Service
General Packet Radio Serviceyes
GPS:Global Positioning System
Global Positioning Systemyes
A-GPS:Assisted Global Positioning System
Assisted Global Positioning Systemyes
LTE:
LTE-FDD: 800, 900, 1800, 2100, 2600
GSM:
850 900 1800 1900
HSDPA:High-Speed Downlink Packet Access
High-Speed Downlink Packet Access850 2100
HSUPA speed:
5,76 Mb/s
HSDPAHigh-Speed Downlink Packet Access speed:
High-Speed Downlink Packet Access speed:42 Mb/s
USB:Universal Serial Bus
Universal Serial Bus2.0
WAP:
yes
Wi-Fi:Wireless lan technology
Wireless lan technology802.11 b/g/n
Multimedia Bundy Mobile Sweet 55 Plus
Audio formats:
AAC, AAC , EAAC , WAV, MP3, MIDI, AMR
Audio out:
Jack 3,5 mm
MP3 player:
yes
MP3 ringtones:
yes
Polyphony:
yes
Radio:
yes
RDS:Radio Data System
Radio Data Systemyes
RSS:
yes
Vibra:
yes
Dictaphone:
yes
Loudspeaker:
yes
Sensors Bundy Mobile Sweet 55 Plus
Accelerometer:
yes
Light sensor:
yes
Proximity sensor:
yes
Design Bundy Mobile Sweet 55 Plus
Dual SIM:
yes
SIM card size:
Micro Sim, Micro Sim
Dimensions:
145.3 x 72.1 x 9 mm, vol. 94.3 cm³
Phone resistant:
no
Battery Bundy Mobile Sweet 55 Plus
Capacity:
Li-Po 2800 mAh
Non-removable battery:
yes
Comments, Questions and Answers about Bundy Mobile Sweet 55 Plus
Ask a question about Bundy Mobile Sweet 55 Plus
Realme has unveiled its flagship GT 7 smartphone outside of China, and with it it showed a limited edition GT 7 Dream Edition and a more affordable GT 7T. All devices received an impressive 7000 mAh battery, IP69 protection and powerful stuffing with advanced cooling. Interestingly, the global version of the GT 7 is different from the Chinese version.
Digital Chat Station and other sources from the Celestial Empire revealed some of the hardware specifications of the yet to be announced flagship smartphone Xiaomi 16. In particular, became known camera configuration and processor model, as well as information about the battery and display size of the gadget.
Vivo has unveiled a new camera phone S30 with a capacious battery, two Sony cameras and front with autofocus. At the same time, the novelty is notable for the high PWM frequency of the display and impressive peak brightness. In addition, the company announced the price of the already announced model S30 Pro mini.