Bundy Mobile Flap specs.
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Basic Spec Bundy Mobile Flap
Chipset:
Is a set of chips in the smartphone that control the CPU.
Is a set of chips in the smartphone that control the CPU.SC6531
RAM Memory:
32.0 MB
Display Bundy Mobile Flap
Display:
TFT Color, 120x160 px (1.8") 111ppi
Touch screen:
no
Storage Bundy Mobile Flap
Built-in memory:
32.0 MB
Memory card:
MicroSD/TransFlash
Camera Bundy Mobile Flap
Camera:
0.3 MPx
Flash:
LED
Autofocus:
no
Optical zoom:
no
Digital zoom:
yes
Communication Bundy Mobile Flap
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.yes
EDGE:
no
GPRS:General Packet Radio Service
General Packet Radio Serviceyes
GPS:Global Positioning System
Global Positioning Systemno
A-GPS:Assisted Global Positioning System
Assisted Global Positioning Systemno
GSM:
850 900 1800 1900
USB:Universal Serial Bus
Universal Serial Bus2.0
WAP:
2.0
Multimedia Bundy Mobile Flap
Audio out:
Jack 3,5 mm
Games:
yes
MP3 player:
yes
MP3 ringtones:
yes
Polyphony:
yes
Radio:
yes
RDS:Radio Data System
Radio Data Systemyes
s
Vibra:
yes
Dictaphone:
yes
Loudspeaker:
yes
Design Bundy Mobile Flap
Dual SIM:
yes
SIM card size:
Mini Sim, Mini Sim
Dimensions:
93.3 x 46.1 x 17.5 mm, vol. 75.3 cm³
Phone resistant:
no
Battery Bundy Mobile Flap
Capacity:
Li-Ion 800 mAh
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