Mobiles     Laptops     Tablets     Computers     Hardware  Components   Electronics   News

Beyond B28 specs.

  Mobiles >> Beyond >> Beyond B28

Specifications | Reviews | Secret codes


Beyond B28




Basic Spec BEYOND B28
Internal memory:
233 KB
Display BEYOND B28
Primary display:
TFT 2.4"
Secondary display:
No
Storage BEYOND B28
Memory Card:
MicroSD,
Main Camera BEYOND B28
Primary camera:
Selfie camera BEYOND B28
Secondary camera:
Sound BEYOND B28
Headphone:
Yes 3.5mm
Network BEYOND B28
EV-DO:
No
GPRS:?General Packet Radio Service
Yes
GSM:
900, 1800
EDGE:
No
Connectivity BEYOND B28
Wi-Fi:?Wireless lan technology
No
NFC:?Near field communication
No
GPS:?Global Positioning System
No
Bluetooth:?Bluetooth is used to exchange data between nearby mobile devices.
No
HDMI:
No
Hotknot:
No
USB:?Universal Serial Bus
No
Infrared:
No
Battery BEYOND B28
Capacity:
Li-Ion
Size BEYOND B28
Dimension:
121 x 63 x 17 mm
SIM:
Mini-SIM, Dual-SIM
Colors:
gold




Comments, Questions and Answers about Beyond B28

Ask a question about Beyond B28
 
  
      4+6= *


Beyond B28
news
 REDMI K90 Max Key Specs Confirmed by Benchmark

Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.



news
 New affordable realme smartphone features a 144Hz display

The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.



news
 The Honor 600 Lite features a body crafted using ?rocket? technology

A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.

The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.