BOCOIN X3-03 specs.
Mobiles >> BOCOIN >> BOCOIN X3-03| Specifications | Reviews | Secret codes |
Basic Spec BOCOIN X3-03
Display BOCOIN X3-03
Primary display:
LCD 2.4" 320 x 240 pixels 256K colors QVGA, 167 ppi
Secondary display:
No
Storage BOCOIN X3-03
Memory Card:
MicroSD, Up to 16 GB
Main Camera BOCOIN X3-03
Primary camera:
2 MP 1600 x 1200 pixels LED flash
Selfie camera BOCOIN X3-03
Secondary camera:
No
Sound BOCOIN X3-03
Headphone:
Yes
Network BOCOIN X3-03
EV-DO:
No
GPRS:
General Packet Radio Service
General Packet Radio ServiceYes
GSM:
850, 900, 1800, 1900
EDGE:
No
Connectivity BOCOIN X3-03
Wi-Fi:Wireless lan technology
Wireless lan technologyNo
NFC:Near field communication
Near field communicationNo
GPS:Global Positioning System
Global Positioning SystemNo
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.No
HDMI:
No
Hotknot:
No
USB:Universal Serial Bus
Universal Serial BusYes
Infrared:
No
Battery BOCOIN X3-03
Capacity:
1150 mAh Li-Ion
Stand by:
Up to 600 h
Talk time:
Up to 7 h
Size BOCOIN X3-03
Dimension:
107 x 47 x 15 mm
Weight:
88 g
SIM:
Mini-SIM, Dual-SIM
Colors:
black, blue, red, yellow, grey, purple, dark-red, wine-red
Comments, Questions and Answers about BOCOIN X3-03
Ask a question about BOCOIN X3-03
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.