Asus Fonepad 8 8GB specs.
Mobiles >> ASUS >> Asus Fonepad 8 8GB| Specifications | Reviews | Secret codes |
| Unlock phone | Root phone |
| Backup | Flash Firmware | Screenshot |
General Information Asus Fonepad 8 8GB
Also Known As:
Asus Fonepad 8 FE380CG
Smart Phone OS:
An operating system (OS) is software that interacts between a user and a smartphone.
An operating system (OS) is software that interacts between a user and a smartphone.Android v4.4 (KitKat)
Custom UI:
Zen UI
SIM Slot(s):
Dual SIM, GSM+GSM
SIM Size:
SIM1: Micro
Network:
3G: Available, 2G: Available
Body Asus Fonepad 8 8GB
Dimensions:
214 (H) x 120 (W) x 8.9 (T) mm
Weight:
328 grams
Colours:
Black Gold Red White
Display Asus Fonepad 8 8GB
Screen Size:This diagonal display size is usually measured in inches.
This diagonal display size is usually measured in inches.8.0 inches
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels800 x 1280 pixels
Pixel Density:
189 ppi
Display Type:
IPS LCD
Touch Screen:
Capacitive Touchscreen, Multi-touch
Performance Asus Fonepad 8 8GB
Chipset:Is a set of chips in the smartphone that control the CPU.
Is a set of chips in the smartphone that control the CPU.Intel Atom Z3530
Processor:
Quad core, 1.33 GHz, Intel Atom
Graphics:
PowerVR G6430
RAM:Random Access Memory
Random Access Memory1 GB
Memory Asus Fonepad 8 8GB
Internal Memory:
8 GB
Expandable Memory:
Up to 64 GB
Camera Asus Fonepad 8 8GB
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels5 MP
Image Resolution:
2592 x 1944 Pixels
Camera Features:
Digital Zoom
Video Recording:
1280x720 fps
Screen Resolution:Screen resolution refers to the size of the image received on the screen in pixels
Screen resolution refers to the size of the image received on the screen in pixels2 MP
Battery Asus Fonepad 8 8GB
Battery capacity:
4000 mAh
Type:
Li-Polymer
Not User Replaceable:
Yes
Connectivity Asus Fonepad 8 8GB
SIM Size:
SIM1: Micro
Network Support:
3G, 2G
SIM 1:
3G Bands: UMTS 1900 / 2100 / 850 / 900 MHz
2G Bands: GSM 1800 / 1900 / 850 / 900 MHz
3G Speed: HSDPAHigh-Speed Downlink Packet Access 42 Mbit/s , HSUPA 5.76 Mbit/s
GPRS:Available
EDGE:Available
2G Bands: GSM 1800 / 1900 / 850 / 900 MHz
3G Speed: HSDPA
High-Speed Downlink Packet Access 42 Mbit/s , HSUPA 5.76 Mbit/sGPRS:Available
EDGE:Available
SIM 2:
2G Bands: GSM 1800 / 1900 / 850 / 900 MHz
Voice Calling:
Yes
Wi-Fi:Wireless lan technology
Wireless lan technologyWi-Fi 802.11, b/g/n
Bluetooth:Bluetooth is used to exchange data between nearby mobile devices.
Bluetooth is used to exchange data between nearby mobile devices.v4.0
GPS:Global Positioning System
Global Positioning Systemwith A-GPSAssisted Global Positioning System
Assisted Global Positioning SystemUSB Connectivity:
microUSB 2.0
Multimedia Asus Fonepad 8 8GB
Loudspeaker:
Yes
Audio Jack:
3.5 mm
Special Features Asus Fonepad 8 8GB
Other Sensors:
Light sensor, Proximity sensor, Accelerometer, Compass
Comments, Questions and Answers about Asus Fonepad 8 8GB
Ask a question about Asus Fonepad 8 8GB
Shortly before its launch, the REDMI K90 Max smartphone appeared in the Geekbench database. The benchmark revealed its performance and, at the same time, disclosed some of the key specifications of the brand's upcoming flagship.
The realme smartphone lineup has been expanded with the new affordable Narzo 100 Lite 5G model. It combines an unusual mix of features typically found in more expensive devices with budget-friendly hardware.
A week after the Honor 600 Lite went on sale, the company shared details about one of the device's key features?its metal body. It is crafted using technology employed in the aerospace and automotive industries.
The Honor 600 Lite is built around an all-metal frame created using vacuum die-casting technology instead of traditional stamping. This new method allows for complex geometric shapes to be achieved directly in the mold, while the frame's wall thickness is less than 0.25 mm?a feat impossible to achieve with conventional machining without sacrificing strength.