Foxconn H55M-S specs
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Processor Foxconn H55M-S
Socket:
LGA1156 package
Processors supported:
Intel Core i7/Core i5/Core i3
Support for multi-core processors:
yes
Chipset Foxconn H55M-S
Chipset:
Intel H55
SLI/CrossFire:
Scalable Link Interface
Scalable Link Interfaceno
Memory Foxconn H55M-S
Memory:
DDR3 DIMM 800 - 1600 MHz
Number of memory slots:
4
Supports dual channel mode:
yes
Maximum memory:
16 GB
Disk controllers Foxconn H55M-S
IDE:Integrated Drive Electronics
Integrated Drive Electronicsno
SATA:Serial Advanced Technology Attachment
Serial Advanced Technology Attachmentnumber of connectors SATA 3Gb/s: 6
Expansion slots Foxconn H55M-S
Expansion slots:
1xPCI-E x16, 1xPCI-E x1, 2xPCI
PCI Express 2.0 support:
yes
Audio/video Foxconn H55M-S
Sound:
7.1CH, HDA
Network Foxconn H55M-S
Ethernet:
1000 Mbps
Connection Foxconn H55M-S
Interfaces:
12 USB, S/PDIF output, 2xCOM, D-Sub, DVI, Ethernet, PS/2 (keyboard), PS/2 (mouse), LPT
Back panel connectors:
6 USB, 1xCOM, D-Sub, DVI, Ethernet, PS/2 (keyboard), PS/2 (mouse)
Main power connector:
24-pin
Processor power connector:
4-pin
Advanced settings Foxconn H55M-S
Form factor:
microATX
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MSI has expanded its lineup of branded motherboards with the announcement of the MAG B850M Gaming Pro MAX. This compact mATX model supports the latest Ryzen 9000 series of processors and is equipped with an OC Engine module that enhances overclocking capabilities.
Two motherboards have been added to MSI's lineup: the ATX PRO Z890-S WIFI6E W and the M-ATX B860M GAMING PLUS WIFI6E. According to company representatives, both are designed specifically for the Intel Core Ultra 200S Plus series of processors.
MSI has unveiled two new micro-ATX motherboards based on the B550 chipset for AM4 socket processors. The MSI PRO B550M-B and B550M-A PRO models are designed for relatively inexpensive gaming builds with DDR4 memory.