ASRock B560M-HDV specs
Motherboards Specs >> ASRock >> ASRock B560M-HDV| Specifications | | | Reviews |
Processor ASRock B560M-HDV
Processor support:
Intel 1200
Number of CPUs supported:
1
Chipset ASRock B560M-HDV
Chipset:
Intel B560 Express
Memory ASRock B560M-HDV
Memory format:
2 X DIMM 288-pin (DDR4)
Memory Frequency(ies):
DDR4 2133 MHz, DDR4 2400 MHz, DDR4 2666 MHz, DDR4 2800 MHz, DDR4 2933 MHz, DDR4 3000 MHz, DDR4 3200 MHz, DDR4 3333 MHz, DDR4 3400 MHz, DDR4 3466 MHz, DDR4 3600 MHz, DDR4 3733 MHz, DDR4 3800 MHz, DDR4 3866 MHz, DDR4 4000 MHz, DDR4 4133 MHz, DDR4 4600 MHz, DDR4 5000 MHz
Memory type:
DDR4
Memory technology:
Dual Channel
Maximum RAM capacity per slot:
32 GB
Maximum RAM capacity:
64 GB
Graphic ASRock B560M-HDV
Integrated graphics controller:
No
Compatible graphics core integrated in the CPU:
Yes
Expansion slots ASRock B560M-HDV
Graphic connector(s):
1 X PCI Express 4.0 x16
Number and Type of slots:
2 X PCI Express 3.0 x1
Multi-GPU type:
None
Audio ASRock B560M-HDV
Audio Chipset:
Realtek ALC897
Number of audio channels:
8
Network ASRock B560M-HDV
Number of ports/Ethernet controler:
1 X Intel I219-V
Network standard(s):
10/100/1000 Mbps
Storage ASRock B560M-HDV
RAID supported:
No
Hard drives connectors:
1 X M.2 - PCI-E 3.0 x4 SATA 6 Gb/s, 1 X M.2 - PCI-E 4.0 x4, 4 X Serial ATA 6Gb/s (SATA Revision 3)
Connectivity ASRock B560M-HDV
Rear panel connectors:
3 X 3.5mm Jack Female Stereo, 1 X MiniDin 6 Female (PS/2), 1 X RJ45 Female, 2 X USB 2.0, 4 X USB 3.0, 1 X DVI Female, 1 X HDMI Female, 1 X VGA (D-sub 15 Female)
Additional connectors:
TPM, Front panel audio, 1 X 12V (Power supply P8), 1 X ATX 24 Pin, 1 X Serial (RS-232), 2 X Internal USB 2.0, 1 X Internal USB 3.0
USB ports:
USB 2.0, USB 3.0
Physical characteristics ASRock B560M-HDV
Motherboard format:
Micro ATX
Length:
244 mm
Width:
198 mm
Equipment ASRock B560M-HDV
Advanced overclocking features:
No
Use:
Office, Multimedia
LED:
No
Reviews, Questions about ASRock B560M-HDV
Write Review / Ask a question about ASRock B560M-HDV
The Colorful CVN B850I GAMING FROZEN motherboard has been announced. It is a 10-layer, Mini-ITX (17 x 17 cm) motherboard based on the B850 chipset and AM5 socket with support for the most advanced AMD processors.
An interesting new product has appeared in the Minisforum product catalog. The BD790i X3D mini-ITX motherboard is designed for assembling a compact but powerful gaming PC. It is equipped with an integrated 16-core Ryzen 9 7945HX3D, one of the most productive laptop chips on the market.
Sapphire has released its first 800 series motherboard - B850M NITRO+. The new motherboard features a Micro-ATX form factor, AM5 socket and supports DDR5-8000 memory.